Datasheet

ManualsBrandsVishay ManualsIR PhotodiodesIR-photodiode 900nm, SMD

VEMD2500X01, VEMD2520X01

www.vishay.com

Vishay Semiconductors

Rev. 1.2, 18-Oct-11

Document Number: 83294

For technical questions, contact: detectortechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Silicon PIN Photodiode

DESCRIPTION

VEMD2500X01 and VEMD2520X01 are high speed and high

sensitive PIN photodiodes in a clear epoxy, miniature

surface mount package (SMD) with dome lens. The photo

sensitive area of the chip is 0.23 mm

FEATURES

• Package type: surface mount

• Package form: GW, RGW

• Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8

• AEC-Q101 qualified

• High radiant sensitivity

• Suitable for visible and near infrared radiation

• Fast response times

• Angle of half sensitivity: ϕ = ± 15°

• Package matched with IR emitter series

VSMB2000X01

• Floor life: 4 weeks, MSL 2a, acc. J-STD-020

• Lead (Pb)-free reflow soldering

• Compliant to RoHS Directive 2002/95/EC and in

accordance to WEEE 2002/96/EC

Note

** Please see document “Vishay Material Category Policy”:

www.vishay.com/doc?99902

APPLICATIONS

• High speed photo detector

Note

• Test conditions see table “Basic Characteristics”

Note

• MOQ: minimum order quantity

16758-11

VEMD2500X01VEMD2520X01

PRODUCT SUMMARY

COMPONENT I

(μA) ϕ (deg) λ

0.1

(nm)

VEMD2500X01 12 ± 15 350 to 1120

VEMD2520X01 12 ± 15 350 to 1120

ORDERING INFORMATION

ORDERING CODE PACKAGING REMARKS PACKAGE FORM

VEMD2500X01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing

VEMD2520X01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing

ABSOLUTE MAXIMUM RATINGS (T

amb

= 25 °C, unless otherwise specified)

PARAMETER TEST CONDITION SYMBOL VALUE UNIT

Reverse voltage V

60 V

Power dissipation T

amb

≤ 25 °C P

215 mW

Junction temperature T

100 °C

Operating temperature range T

amb

- 40 to + 100 °C

Storage temperature range T

stg

- 40 to + 100 °C

Soldering temperature Acc. reflow solder profile fig. 7 T

260 °C

Thermal resistance junction/ambient Acc. J-STD-051 R

thJA

250 K/W

Summary of content (8 pages)

PAGE 1
VEMD2500X01, VEMD2520X01 www.vishay.com Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: surface mount • Package form: GW, RGW VEMD2520X01 • Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8 VEMD2500X01 • AEC-Q101 qualified • High radiant sensitivity • Suitable for visible and near infrared radiation • Fast response times • Angle of half sensitivity: ϕ = ± 15° • Package matched with IR emitter series VSMB2000X01 16758-11 • Floor life: 4 weeks, MSL 2a, acc.
PAGE 2
VEMD2500X01, VEMD2520X01 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL IF = 50 mA VF IR = 100 μA, E = 0 V(BR) VR = 10 V, E = 0 Iro VR = 0 V, f = 1 MHz, E = 0 CD 4 pF VR = 5 V, f = 1 MHz, E = 0 CD 1.3 pF Forward voltage Breakdown voltage Reverse dark current Diode capacitance MIN. TYP. MAX.
PAGE 3
VEMD2500X01, VEMD2520X01 www.vishay.com Vishay Semiconductors 0° 10° 20° 10 VCE = 5 V λ = 950 nm 1.0 40° 1.0 0.9 50° 0.8 60° 70° 0.7 ϕ - Angular Displacement 30° Srel - Relative Sensitivity Ira - Reverse Light Current (µA) 100 80° 0.1 0.01 0.1 16055 1 0.6 10 0.4 0.2 0 94 8248 Ee - Irradiance (mW/cm²) Fig. 3 - Reverse Light Current vs. Irradiance Fig. 6 - Relative Radiant Sensitivity vs. Angular Displacement CD - Diode Capacitance (pF) 8 6 E=0 f = 1 MHz 4 2 0 1 0.
PAGE 4
VEMD2500X01, VEMD2520X01 www.vishay.com Vishay Semiconductors REFLOW SOLDER PROFILE DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. 300 Temperature (°C) max.
PAGE 5
VEMD2500X01, VEMD2520X01 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VEMD2520X01 Ø 1.8 2.77 ± 0.2 0.3 0.4 0.19 0.05 1.6 X 2.2 2.2 4.2 ± 0.2 X 20:1 exposed copper 0.6 Cathode 0.254 2.3 ± 0.2 0.4 0.5 2.3 ± 0.2 Anode Pin ID technical drawings according to DIN specifications 0.75 Solder pad proposal acc. IPC 7351 Not indicated tolerances ± 0.1 2.45 5.15 Drawing-No.: 6.544-5383.02-4 Issue: 4; 18.03.10 21488 Rev. 1.
PAGE 6
VEMD2500X01, VEMD2520X01 www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VEMD2500X01 Unreel direction X 2. Ø 62 ± 0.5 Reel 0 5± Ø 13 ± 0.5 Ø 330 ± 1 .5 Tape position coming out from reel 6000 pcs/reel Label posted here Technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Devicce Lead I Lead II Collector Emitter Cathode Anode Anode Cathode Ø 1.55 ± 0.
PAGE 7
VEMD2500X01, VEMD2520X01 www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VEMD2520X01 Reel X Unreel direction 5± Ø 62 ± 0.5 2. Ø 13 ± 0.5 Ø 330 ± 1 0.5 Tape position coming out from reel 6000 pcs/reel Label posted here technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Ø 1.55 ± 0.
PAGE 8
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