Datasheet

VLMR51Z1AA, VLMK51Z1AA, VLMY51Z1AA
www.vishay.com
Vishay Semiconductors
Rev. 1.4, 03-Sep-13
8
Document Number: 83419
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SOLDERING PROFILE
Fig. 8 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020)
BAR CODE PRODUCT LABEL (example)
A) Type of component
B) Manufacturing plant
C) SEL - selection code (bin):
e.g.: V1 = code for luminous intensity group
5L = code for chrom. coordinate group
D) Date code year/week
E) Day code (e.g. 1: Monday)
F) Batch no.
G) Total quantity
H) Company code
DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
FINAL PACKING
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 672 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen)
or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JESD22-A112 level 2a label is
included on all dry bags.
Example of JESD22-A112 Level 2a Label
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electro-static
sensitive devices warning labels are on the packaging.
0
50
100
150
200
250
300
0 50 100 150 200
250 300
t [s]
T [°C]
255°C
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 30 s
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
255 °C
19470-3
max. 2 cycles allowed
IR Reflow Soldering Profile for lead (Pb)-free soldering
Preconditioning acc. to JEDEC Level 2a
106
37
A
H
BC D E F G
19795
Aluminum bag
Label
Reel
15973
L E V E L
CAUTION
This bag contains
MOISTURE –SENSITIVE DEVICES
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
a) Mounted within
672 hours
at factory condition of <
30°C/60%RH or
b) Stored at <1
0% RH.
3. Devices require baking before mounting if:
a) Humidity Indicator Card is >10% when read at 23°C +
5°C or
b) 2a or 2b is not met.
4. If baking is required, devices may be baked for:
192 hours
at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
or
96 hours
at 60±5
o
Cand <5%RH For
all
device containers
or
24 hours
at 100±5°C Not suitable for
reels or tubes
Bag Seal Date: ______________________________
(If blank, see bar code label)
Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
2a
19786