Datasheet

ManualsBrandsVISHAY ManualsLEDs & AccessoriesSMD LED 1608 Cold white 112.5 mcd 130 ° 5 mA 2.93 V

VLMW1300

www.vishay.com

Vishay Semiconductors

Rev. 1.2, 22-Sep-14

Document Number: 82435

For technical questions, contact: LED@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Highbright 0603 ChipLED

DESCRIPTION

The new 0603 ChipLED series have been designed in the

smallest SMD package. This innovative 0603 ChipLED

technology opens the way to

• Smaller products of higher performance

• More design in flexibility

• Enhanced applications

The 0603 LED is an obvious solution for small-scale

products that are expected to work reliably in an arduous

environment.

This package is filled with a mixture of epoxy and yellow

converter.

This yellow converter converts the blue emission partially to

yellow, which mixes the remaining blue to give white.

PRODUCT GROUP AND PACKAGE DATA

• Product group: LED

• Package: SMD 0603 ChipLED

• Product series: standard

• Angle of half intensity: ± 65°

FEATURES

• High efficient InGaN technology

• Super thin ChipLED with exceptional brightness

1.6 mm x 0.8 mm x 0.55 mm (L x W x H)

• High reliability PCB based

• Temperature range -20 °C to +80 °C

• Chromaticity coordinate categorized according

to CIE 1931 per packing unit

• Typical color temperature 7000 K

• EIA standard package

• Compatible to IR reflow soldering

• Available on 7" diameter reel

• Preconditioning according to JEDEC

level 2a

• ESD-sensitive device

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

• Telecommunication: indicator and backlighting in

telephone and fax

• Backlighting for audio and video equipment

• Backlighting in office equipment

• Indoor and outdoor message boards

• Flat backlight for LCDs, switches, and symbols

PARTS TABLE

PART COLOR

LUMINOUS INTENSITY

(mcd)

at I

(mA)

COORDINATE

(x, y)

at I

(mA)

FORWARD VOLTAGE

(V)

at I

(mA)

TECHNOLOGY

MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.

VLMW1300-GS08 White 45 - 180 5 -

0.294,

0.286

-52.70-3.155

InGaN/

yellow converter

ABSOLUTE MAXIMUM RATINGS (T

amb

= 25 °C, unless otherwise specified)

VLMW1300

PARAMETER TEST CONDITION SYMBOL VALUE UNIT

DC forward current T

amb

≤ 25 °C I

20 mA

Surge forward current t

≤ 10 μs I

FSM

0.1 A

Power dissipation P

70 mW

Operating temperature range T

amb

-20 to +80 °C

Storage temperature range T

stg

-55 to +105 °C

Thermal resistance junction/ambient R

thJA

550 K/W

Summary of content (8 pages)

PAGE 1
VLMW1300 www.vishay.com Vishay Semiconductors Highbright 0603 ChipLED FEATURES • High efficient InGaN technology • Super thin ChipLED with exceptional brightness 1.6 mm x 0.8 mm x 0.
PAGE 2
VLMW1300 www.vishay.com Vishay Semiconductors OPTICAL AND ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) VLMW1300, WHITE PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Luminous intensity IF = 5 mA IV 45 - 180 mcd Chromatically coordinate x acc. to CIE 1931 IF = 5 mA x - 0.294 - Chromatically coordinate y acc. to CIE 1931 IF = 5 mA y - 0.286 - Angle of half intensity IF = 5 mA ϕ - ± 65 - Forward voltage IF = 5 mA VF 2.70 - 3.
PAGE 3
VLMW1300 www.vishay.com Vishay Semiconductors TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 4 Relative Luminous Intensity Normalized at 5 mA IF - Forward Current (A) 25 20 15 10 5 3 2 1 0 0 0 20 40 60 80 100 0 10 Tamb Ambient Temperature (°C) Fig. 1 - Forward Current vs. Ambient Temperature Irel - Relative Luminous Intensity Irel - Relative Intensity 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 1 0.
PAGE 4
VLMW1300 www.vishay.com 10° 20° 30° 40° 1.0 50° 0.9 60° 0.8 70° 0.7 80° 0.6 0.4 0.2 ϕ - Angular Displacement Irel - Relative Luminous Intensity 0° Vishay Semiconductors 0 Fig. 7 - Relative Luminous Intensity vs. Angular Displacement Ø 60 ± 1 Ø 178 ± 2 Ø 13 REEL DIMENSIONS in millimeters 9.4 ± 1.5 Drawing-No.: 9.800-5122.01-4 Issue: 2; 03.11.11 22611 Rev. 1.
PAGE 5
VLMW1300 www.vishay.com Vishay Semiconductors TAPE DIMENSIONS in millimeters 0.25 0.7 B - B (5:1) 8 + 0.3 - 0.1 1.75 ± 0.1 B B Ø 1.55 ± 0.05 Ø 0.5 2 ± 0.05 4 ± 0.1 4 ± 0.1 User feed direction Cathode 3.5 ± 0.05 technical drawings according to DIN specifications Drawing-No.: 9.700-5385.01-4 Issue: 1; 17.10.11 22612 Rev. 1.2, 22-Sep-14 Document Number: 82435 5 For technical questions, contact: LED@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.
PAGE 6
VLMW1300 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 0.3 0.3 0.8 0.77 Recommended solder pad footprint 0.8 2.3 0.28 0.55 1.1 0.8 0.3 Cathode 1.6 technical drawings according to DIN specifications Not indicated tolerances ± 0.2 Drawing-No.: 6.541-5091.01-4 Issue: 1; 17.10.11 22613 SOLDERING PROFILE IR Reflow Soldering Profile for lead (Pb)-free Soldering Preconditioning acc. to JEDEC Level 2a 300 Temperature (°C) max.
PAGE 7
VLMW1300 www.vishay.com Vishay Semiconductors BAR CODE PRODUCT LABEL (Example) RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: A B C D • Storage temperature 10 °C to 30 °C L E I G F H M K A. 2D barcode B. PartNo = Vishay part number C. QTY = Quantity D. SelCode = selection code (binning) E. PTC = Code of manufacturing plant F.
PAGE 8
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