User Manual

www.vishay.com For technical questions, contact: [e-mail]
Document Number: 94512
2 Revision: 25-Apr-08
VSKDU162/12PbF
Vishay High Power Products
HEXFRED
®
Ultrafast Diodes, 100 A
(New INT-A-PAK
TM
Power Modules)
BLOCKING
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum peak reverse
leakage current
I
RRM
T
J
= 150 °C 30 mA
RMS insulation voltage V
INS
50 Hz, circuit to base, all terminals shorted, t = 1 s 3500 V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction operating and
storage temperature range
T
J
, T
Stg
- 40 to 150 °C
Maximum thermal resistance,
junction to case per junction
R
thJC
DC operation 0.18
K/W
Typical thermal resistance,
case to heatsink
R
thCS
Mounting surface, flat, smooth and greased 0.05
Mounting
torque ± 10 %
to heatsink
A mounting compound is recommended and the
torque should be rechecked after a period of 3 hours
to allow the spread of the compound.
4 to 6 Nm
busbar
Approximate weight
200 g
7.1 oz.
Case style New INT-A-PAK