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VSMB2000X01, VSMB2020X01

www.vishay.com

Vishay Semiconductors

Rev. 1.5, 23-Aug-11

Document Number: 81930

For technical questions, contact: emittertechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, DH

DESCRIPTION

VSMB2000X01 series are infrared, 940 nm emitting diodes

in GaAlAs (DH) technology with high radiant power and high

speed, molded in clear, untinted plastic packages (with lens)

for surface mounting (SMD).

APPLICATIONS

• IrDA compatible data transmission

• Miniature light barrier

• Photointerrupters

• Optical switch

• Control and drive circuits

• Shaft encoders

FEATURES

• Package type: surface mount

• Package form: GW, RGW

• Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8

• AEC-Q101 qualified

• Peak wavelength: 

= 940 nm

• High reliability

• High radiant power

• High radiant intensity

• Angle of half intensity:  = ± 12°

• Low forward voltage

• Suitable for high pulse current operation

• Terminal configurations: gullwing or reserve gullwing

• Package matches with detector VEMD2000X01 series

• Floor life: 4 weeks, MSL 2a, acc. J-STD-020

• Compliant to RoHS Directive 2002/95/EC and in

accordance to WEEE 2002/96/EC

Note

** Please see document “Vishay Material Category Policy”:

www.vishay.com/doc?99902

Note

• Test conditions see table “Basic Characteristics“

Note

• MOQ: minimum order quantity

21725-4

VSMB2000X01 VSMB2020X01

PRODUCT SUMMARY

COMPONENT I

(mW/sr)  (deg) 

(nm) t

(ns)

VSMB2000X01 40 ± 12 940 15

VSMB2020X01 40 ± 12 940 15

ORDERING INFORMATION

ORDERING CODE PACKAGING REMARKS PACKAGE FORM

VSMB2000X01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing

VSMB2020X01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing

ABSOLUTE MAXIMUM RATINGS (T

amb

= 25 °C, unless otherwise specified)

PARAMETER TEST CONDITION SYMBOL VALUE UNIT

Reverse voltage V

Forward current I

100 mA

Peak forward current t

/T = 0.5, t

 100 μs I

200 mA

Surge forward current t

= 100 μs I

FSM

Power dissipation P

160 mW

Junction temperature T

100 °C

Operating temperature range T

amb

- 40 to + 85 °C

Storage temperature range T

stg

- 40 to + 100 °C

Soldering temperature t  5 s T

260 °C

Thermal resistance junction/ambient

J-STD-051, leads 7 mm,

soldered on PCB

thJA

250 K/W

Summary of content (8 pages)

PAGE 1
VSMB2000X01, VSMB2020X01 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, DH VSMB2000X01 FEATURES VSMB2020X01 • Package type: surface mount • Package form: GW, RGW • Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.
PAGE 2
VSMB2000X01, VSMB2020X01 www.vishay.com Vishay Semiconductors 120 160 IF - Forward Current (mA) PV - Power Dissipation (mW) 180 140 120 100 RthJA = 250 K/W 80 60 40 100 80 60 RthJA = 250 K/W 40 20 20 0 0 0 10 21343 20 30 40 50 60 70 80 90 0 100 10 Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) 21344 Tamb - Ambient Temperature (°C) 20 30 40 Fig. 2 - Forward Current Limit vs.
PAGE 3
VSMB2000X01, VSMB2020X01 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 180 Ie rel - Relative Radiant Intensity (%) 100 10 tp = 100 µs tp/T= 0.001 IF = 1 mA 160 140 120 IF = 100 mA 100 80 60 tp = 20 ms 1 40 0 1 2 3 VF - Forward Voltage (V) 21534 - 60 - 40 - 20 Fig. 3 - Forward Current vs.
PAGE 4
VSMB2000X01, VSMB2020X01 www.vishay.com Vishay Semiconductors SOLDER PROFILE DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. 300 Temperature (°C) max.
PAGE 5
VSMB2000X01, VSMB2020X01 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMB2020 Ø 1.8 2.77 ± 0.2 0.3 0.4 0.19 0.05 1.6 X 2.2 2.2 4.2 ± 0.2 X 20:1 exposed copper 0.6 Cathode 0.254 2.3 ± 0.2 0.4 0.5 2.3 ± 0.2 Anode Pin ID technical drawings according to DIN specifications 0.75 Solder pad proposal acc. IPC 7351 Not indicated tolerances ± 0.1 2.45 5.15 Drawing-No.: 6.544-5383.02-4 Issue: 4; 18.03.10 21488 Rev. 1.
PAGE 6
VSMB2000X01, VSMB2020X01 www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMB2000 Unreel direction X 2. Ø 62 ± 0.5 Reel 0 5± Ø 13 ± 0.5 Ø 330 ± 1 .5 Tape position coming out from reel 6000 pcs/reel Label posted here Technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Devicce Lead I Lead II Collector Emitter Cathode Anode Anode Cathode Ø 1.55 ± 0.
PAGE 7
VSMB2000X01, VSMB2020X01 www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMB2020 Reel X Unreel direction 5± Ø 62 ± 0.5 2. Ø 13 ± 0.5 Ø 330 ± 1 0.5 Tape position coming out from reel 6000 pcs/reel Label posted here technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Ø 1.55 ± 0.
PAGE 8
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