Datasheet

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VSMG2700

www.vishay.com

Vishay Semiconductors

Rev. 1.4, 24-Sep-13

Document Number: 81472

For technical questions, contact: emittertechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

High Speed Infrared Emitting Diode, 830 nm,

GaAlAs Double Hetero

DESCRIPTION

VSMG2700 is an infrared, 830 nm emitting diode in GaAlAs

double hetero (DH) technology with high radiant power and

high speed, molded in a PLCC-2 package for surface

mounting (SMD).

FEATURES

• Package type: surface mount

• Package form: PLCC-2

• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75

• Peak wavelength: λ

= 830 nm

• High reliability

• High radiant power

• High radiant intensity

• Angle of half intensity: ϕ = ± 60°

• Low forward voltage

• Suitable for high pulse current operation

• High modulation band width: f

= 18 MHz

• Good spectral matching with Si photodetectors

• Floor life: 168 h, MSL 3, acc. J-STD-020

• Lead (Pb)-free reflow soldering

• AEC-Q101 qualified

• Material categorization: For definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

• Infrared radiation source for operation with CMOS

cameras (illumination)

• High speed IR data transmission

Note

• Test conditions see table “Basic Characteristics”

Note

• MOQ: minimum order quantity

948553

PRODUCT SUMMARY

COMPONENT I

(mW/sr) ϕ (deg) λ

(nm) t

(ns)

VSMG2700 10 ± 60 830 20

ORDERING INFORMATION

ORDERING CODE PACKAGING REMARKS PACKAGE FORM

VSMG2700-GS08 Tape and reel MOQ: 7500 pcs, 1500 pcs/reel PLCC-2

VSMG2700-GS18 Tape and reel MOQ: 8000 pcs, 8000 pcs/reel PLCC-2

Summary of content (6 pages)

PAGE 1
VSMG2700 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diode, 830 nm, GaAlAs Double Hetero FEATURES • Package type: surface mount • Package form: PLCC-2 • Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.
PAGE 2
VSMG2700 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage Forward current IF 100 mA Peak forward current tp/T = 0.
PAGE 3
VSMG2700 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1.25 10 000 0.01 1000 0.02 0.05 100 0.2 0.5 DC 0.1 10 1 0.01 0.1 1 10 0.75 0.5 0.25 0 740 100 tp - Pulse Length (ms) 95 9985 1.0 Fig. 3 - Pulse Forward Current vs. Pulse Duration 900 800 λ- Wavelength (nm) 16972_1 Fig. 6 - Relative Radiant Power vs.
PAGE 4
VSMG2700 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 0.9 1.75±0.1 3.5±0.2 0.8 Technical drawings according to DIN specifications A C 2.2 2.8±0.15 Pin identification Dimensions in mm Drawing-No.: 6.541-5067.01-4 Issue: 6; 23.09.13 Ø2.4 3 +0.15 Mounting Pad Layout Area covered with solderresist 4 2.6 (2.8) 1.2 1.6 (1.9) 4 Dimensions: Reflow and vapor phase (wave soldering) SOLDER PROFILE DRYPACK 300 Temperature (°C) max.
PAGE 5
VSMG2700 www.vishay.com Vishay Semiconductors TAPE AND REEL PLCC-2 components are packed in antistatic blister tape (DIN IEC (CO) 564) for automatic component insertion. Cavities of blister tape are covered with adhesive tape. 10.0 9.0 120° 4.5 3.5 13.00 12.75 2.5 1.5 Adhesive tape Identification Label: Vishay type group tape code production code quantity Blister tape Component cavity 94 8670 63.5 60.5 14.4 max. 180 178 94 8665 Fig. 12 - Dimensions of Reel-GS08 Fig. 9 - Blister Tape 4.5 3.
PAGE 6
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