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VSMY2850RG, VSMY2850G

www.vishay.com

Vishay Semiconductors

Rev. 1.5, 06-Sep-13

Document Number: 83398

For technical questions, contact: emittertechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

High Speed Infrared Emitting Diodes, 850 nm,

Surface Emitter Technology

DESCRIPTION

As part of the SurfLight

portfolio, the VSMY2850 series

are infrared, 850 nm emitting diodes based on GaAlAs

surface emitter chip technology with extreme high radiant

intensities, high optical power and high speed, molded in

clear, untinted plastic packages (with lens) for surface

mounting (SMD).

APPLICATIONS

• IrDA compatible data transmission

• Miniature light barrier

• Photointerrupters

• Optical switch

• Emitter source for proximity sensors

• IR touch panels

• IR illumination

FEATURES

• Package type: surface mount

• Package form: GW, RGW

• Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8

• Peak wavelength: λ

= 850 nm

• High reliability

• High radiant power

• Very high radiant intensity

• Angle of half intensity: ϕ = ± 10°

• Suitable for high pulse current operation

• Terminal configurations: gullwing or reverse gullwing

• Package matches with detector VEMD2500X01 series

• Floor life: 4 weeks, MSL 2a, acc. J-STD-020

• Material categorization: For definitions of compliance

please see www.vishay.com/doc?99912

Note

• Test conditions see table “Basic Characteristics“

Note

• MOQ: minimum order quantity

VSMY2850RG VSMY2850G

PRODUCT SUMMARY

COMPONENT I

(mW/sr) ϕ (deg) λ

(nm) t

(ns)

VSMY2850RG 100 ± 10 850 10

VSMY2850G 100 ± 10 850 10

ORDERING INFORMATION

ORDERING CODE PACKAGING REMARKS PACKAGE FORM

VSMY2850RG Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing

VSMY2850G Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing

Summary of content (9 pages)

PAGE 1
VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 850 nm, Surface Emitter Technology VSMY2850RG FEATURES VSMY2850G • Package type: surface mount • Package form: GW, RGW • Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.
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VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage Forward current IF 100 mA Peak forward current tp/T = 0.
PAGE 3
VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1000 Ie - Radiant Intensity (mW/sr) IF - Forward Current (mA) 1000 tp = 100 μs 100 10 1 tp = 100 μs 100 10 1 0.1 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 1 VF - Forward Voltage (V) VF - Forward Voltage (V) IF = 100 mA 1.80 1.70 1.60 1.50 1.
PAGE 4
VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors Fig. 10 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 10° 20° DRYPACK 30° 40° 1.0 50° 0.9 60° 0.8 70° ϕ - Angular Displacement Ie rel - Relative Radiant Intensity 0° 80° 0.7 0.6 21111 0.4 0.2 0 Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant.
PAGE 5
VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors PACKAGE DIMENISONS in millimeters: VSMY2850RG Ø 1.8 ± 0.1 0.3 Z 1.6 0.19 2.77 ± 0.2 0.05 ± 0.1 0.4 2.2 2.2 5.8 ± 0.2 Z 20:1 1.1 ± 0.1 Exposed copper 0.254 0.5 2.3 ± 0.2 0.4 2.3 ± 0.2 Pin ID Anode 1.7 Cathode 0.75 Solder pad proposal acc. IPC 7351 technical drawings according to DIN specifications Not indicated tolerances ± 0.1 Ø 2.3 ± 0.1 6.7 Drawing-No.: 6.544-5391.03-4 Issue: 1; 18.03.10 22100 Rev. 1.
PAGE 6
VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMY2850G Ø 1.8 2.2 0.19 1.6 X 0.05 2.77 ± 0.2 0.3 0.4 2.2 4.2 ± 0.2 Exposed copper X 20:1 0.6 Anode 0.75 0.254 0.5 2.3 ± 0.2 0.4 2.3 ± 0.2 Pin ID Cathode technical drawings according to DIN specifications Solder pad proposal acc. IPC 7351 Not indicated tolerances ± 0.1 2.45 5.15 Drawing-No.: 6.544-5383.03-4 Issue: 1; 18.03.10 22099 Rev. 1.
PAGE 7
VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY2850RG Unreel direction X 2. Ø 62 ± 0.5 Reel Ø 13 ± 0.5 Ø 330 ± 1 0.5 5± Tape position coming out from reel 6000 pcs/reel Label posted here Technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Devicce Lead I Lead II Collector Emitter Cathode Anode Anode Cathode Ø 1.55 ± 0.
PAGE 8
VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY2850G Reel X Unreel direction 5± Ø 62 ± 0.5 2. Ø 13 ± 0.5 Ø 330 ± 1 0.5 Tape position coming out from reel 6000 pcs/reel Label posted here technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Ø 1.55 ± 0.
PAGE 9
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