Data Sheet

we-online.com
Würth Elektronik eiSos GmbH & Co. KG - Data Sheet - REV 1.0
21/31
WPMDH1102401 / 171012401
MagI³C Power Module
VDRM - Variable Step Down Regulator Module
DESIGN FLOW
4: Make input and output bus connections as wide as possible.
This reduces any voltage drops on the input or output of the converter and maximizes efficiency.
5: Provide adequate device heat-sinking.
Use an array of heat-sinking vias to connect the exposed pad to the ground plane on the bottom PCB layer. If the
PCB has a plurality of copper layers, these thermal vias can also be used to make connection to inner layer heat-
spreading ground planes. For best results use a 6 x 6 via array with minimum via diameter of 254μm thermal vias
spaced 1.5mm. Ensure enough copper area is used for heat-sinking to keep the junction temperature below 125°C.