Datasheet

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© May 2016
Würth Elektronik eiSos GmbH & Co. KG - Data Sheet - REV 1.0
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WPMDU1251501 / 171021501
MagI³C Power Module
VDRM - Variable Step Down Regulator Module
5: Provide adequate device heat-sinking
Place a dedicated AGND copper area beneath the MagI³C Power Module.
C
IN1
C
IN2
C
IN3
C
OUT1
C
OUT2
R
SET
R
RT
C
SS
R
UVLO2
R
UVLO1
V
IN
V
OUT
PGND
SW
AGND
FB
EN/UVLO
RT/CLK
SS/TRK
INTSS
PG
Use an array of heat-sinking vias to connect the AGND pad to the ground plane on the bottom PCB layer. If the PCB has
a plurality of copper layers, these thermal vias can also be used to make connection to inner layer heat-spreading ground
planes. It is recommended to use a via array as proposed in the picture above with via diameter of 300μm (hole:100µm)
thermal vias spaced 400µm. Ensure enough copper area is used for heat-sinking to keep the junction temperature below
125°C.
6: Isolate high noise areas
Place a dedicated AGND copper area beneath the MagI³C Power Module.