Datasheet

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© May 2016
Würth Elektronik eiSos GmbH & Co. KG - Data Sheet - REV 1.0
40/46
WPMDU1251501 / 171021501
MagI³C Power Module
VDRM - Variable Step Down Regulator Module
HANDLING RECOMMENDATIONS
1. f
SOLDER PROFILE
1. Only Pb-Free assembly is recommended according to JEDEC J-STD020.
2. Measure the peak reflow temperature of the MagI³C power module in the middle of the top view.
3. Ensure that the peak reflow temperature does not exceed 245°C ±5°C as per JEDEC J-STD020.
4. The reflow time period during peak temperature of 245°C ±5°C must not exceed 30 seconds.
5. Reflow time above liquidus (217°C) must not exceed 90 seconds.
6. Maximum ramp up is rate 3°C per second
7. Maximum ramp down rate is 3°C per second
8. Reflow time from room (25°C) to peak must not exceed 8 minutes as per JEDEC J-STD020.
9. Maximum numbers of reflow cycles is three.
10. For minimum risk, solder the module in the last reflow cycle of the PCB production.
11. For soldering process please consider lead material copper (Cu) and lead finish tin (Sn).
12. For solder paste use a standard SAC Alloy such as SAC 305, type 3 or higher.
13. Below profile is valid for convection reflow only
14. Other soldering methods (e.g.vapor phase) are not verified and have to be validated by the customer on his own risk
Temperature [°C]
Time [sec]
150
180
217
Max 250
Max 120 sec
Min 60 sec
Max 90 sec
Min 30 sec
Max 10 - 30 sec
245°C
Ramp Up Rate
Max 3°C/sec
Ramp Down Rate
Max 3°C/sec
Max 3 solder cycles !
Preheat
Liquidus
Peak