Datasheet
WPMDB1400362Q / 171040302
MagI
3
C Power Module
VDRM – Variable Step Down Regulator Module
we-online.com Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
© May 2016 40/48
6: Provide adequate device heat-sinking
Place a dedicated PGND copper area beneath the MagI³C Power Module.
Use an array of heat-sinking vias to connect the PGND pad to the ground plane on the bottom PCB layer. If the PCB has a
plurality of copper layers, these thermal vias can also be used to make connection to inner layer heat-spreading ground
planes. For best results use a via array as proposed in the picture above with via diameter of 200μm (hole: 100µm) thermal
vias spaced 200µm. Ensure enough copper area is used for heat-sinking to keep the junction temperature below 125°C.
C
IN1
C
IN2
C
OUT1
C
OUT2
R
SET
R
RT
MagI
3
C Module
V
IN +
V
IN -
V
OUT -
V
OUT +
Bottom
GROUND PLANE
VIN
VIN
VIN
AGND
AGND
FB
VSENSE+
PGND
VOUT
RT/CLK
30
31
32
33
34
35
36
4
38
9
10
11
8
12
13
14
SW
1
29
28 27
UVLO
ENABLE
PG
6
SS/TRK
5 7
39
37
C
SS
6: Isolate high noise areas
Place a dedicated solid GND copper area beneath the MagI³C Power Module.
C
IN1
C
IN2
C
OUT1
C
OUT2
R
SET
R
RT
MagI
3
C Module
V
IN +
V
IN -
V
OUT -
V
OUT +
Bottom
GROUND PLANE
VIN
VIN
VIN
AGND
AGND
FB
VSENSE+
PGND
VOUT
RT/CLK
30
31
32
33
34
35
36
4
38
9 10
11
8
12
13
14
SW
1
29
28 27
UVLO
ENABLE
PG
6
SS/TRK
5 7
39
37
C
SS