Datasheet
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Würth Elektronik eiSos GmbH & Co. KG - Data Sheet - REV 1.0
19/25
WPMDM1500602/ 171050601
MagI³C Power Module
VDRM - Variable Step Down Regulator Module
HANDLING RECOMMENDATIONS
1. The power module is classified as MSL3 (JEDEC Moisture Sensitivity Level 3) and requires special handling
due to moisture sensitivity (JEDEC J-STD033).
2. The parts are delivered in a sealed bag (Moisture Barrier Bags = MBB) and should be processed within one
year.
3. When opening the moisture barrier bag check the Humidity Indicator Card (HIC) for color status. Bake parts
prior to soldering in case indicator color has changed according to the notes on the card .
4. Parts must be processed after 168 hour (7 days) of floor life. Once this time has been exceeded, bake parts
prior to soldering per JEDEC J-STD033 recommendation.
SOLDER PROFILE
1. Only Pb-Free assembly is recommended according to JEDEC J-STD020.
2. Measure the peak reflow temperature of the MagI³C power module in the middle of the top view.
3. Ensure that the peak reflow temperature does not exceed 240°C ±5°C as per JEDEC J-STD020.
4. The reflow time period during peak temperature of 240°C ±5°C must not exceed 20 seconds.
5. Reflow time above liquidus (217°C) must not exceed 60 seconds.
6. Maximum ramp up is rate 3°C per second
7. Maximum ramp down rate is 6°C per second
8. Reflow time from room (25°C) to peak must not exceed 8 minutes as per JEDEC J-STD020.
9. Maximum numbers of reflow cycles is two.
10. For minimum risk, solder the module in the last reflow cycle of the PCB production.
11. For soldering process please consider lead material copper (Cu) and lead finish tin (Sn).
12. For solder paste use a standard SAC Alloy such as SAC 305, type 3 or higher.
13. Below profile is valid for convection reflow only
14. Other soldering methods (e.g.vapor phase) are not verified and have to be validated by the customer on his
own risk
Temperature [°C]
Time [sec]
150
180
217
Max 245
Max 120 sec
Min 60 sec
Max 60 sec
Min 30 sec
Max 10 - 20 sec
240°C
Ramp Up Rate
Max 3°C/sec
Ramp Down Rate
Max 6°C/sec
Max 2 solder cycles !
Preheat
Liquidus
Peak