Datasheet

System
Load
bq5101xB
PGND
OUT
EN1 / TERM
AD
/AD-EN
/WPG
C
4
EN2
C
1
C
2
C
BOOT1
C
BOOT2
AC1
AC2
COMM2
ILIM
R
FOD
CLAMP2
C
COMM2
C
CLAMP2
COIL
BOOT1
RECT
C
3
NTC
TS-CTRL
BOOT2
CLAMP1
C
CLAMP1
C
COMM1
COMM1
HOST
Tri-State
Bi-State
Bi-State
FOD
R
1
R
OS1
R
4
D
1
R
OS2
bq51013B
www.ti.com SLUSB62A –MARCH 2013–REVISED OCTOBER 2013
THERMAL INFORMATION
RHL YFP
THERMAL METRIC
(1)
UNITS
20 PiNS 28 PINS
θ
JA
Junction-to-ambient thermal resistance 37.7 58.9
θ
JCtop
Junction-to-case (top) thermal resistance 35.5 0.2
θ
JB
Junction-to-board thermal resistance 13.6 9.1
°C/W
ψ
JT
Junction-to-top characterization parameter 0.5 1.4
ψ
JB
Junction-to-board characterization parameter 13.5 8.9
θ
JCbot
Junction-to-case (bottom) thermal resistance 2.7 n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNITS
V
IN
Input voltage range RECT 4 10 V
I
IN
Input current RECT 1.5 A
I
OUT
Output current OUT 1.5 A
I
AD-EN
Sink current AD-EN 1 mA
I
COMM
COMM sink current COMM 500 mA
T
J
Junction Temperature 0 125 °C
TYPICAL APPLICATION SCHEMATICS
Figure 2. bq5101xB Used as a Wireless Power Receiver and Power Supply for System Loads
Only one of R
OS1
or R
OS2
needed
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