Data Sheet
Data sheet | Item number:2059-302/998-403
www.wago.com/2059-302/998-403
06.12.2018Page /2 4
Available in tape-and-reel packaging for automated assembly
Note:
Application note:
Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max. 260 °C peak temperature. Due to customer-
specific variables (e.g., component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure
product and process compatibility under actual manufacturing conditions.
Recommendation:
Recommendation for SMD stencil:
Material thickness, 150 µm. Pattern layout identical to solder pad layout.
Data
Electrical data
Ratings per IEC/EN 60664-1
Rated voltage (III / 3) 63 V
Rated impulse voltage (III / 3) 2.5 kV
Rated voltage (III / 2) 160 V
Rated impulse voltage (III / 2) 2.5 kV
Rated voltage (II / 2) 320 V
Rated impulse voltage (II / 2) 2.5 kV
Rated current 3 A
Legend (ratings) (III / 2) ≙ Overvoltage category III / Pollution degree 2
Connection data
Connection technology
PUSH WIRE
®
Actuation type Operating tool
Solid conductor 0.14 … 0.34 mm² / 26 … 22 AWG
Strip length 4 … 5.5 mm / 0.16 … 0.22 Inch
Conductor entry angle to the PCB 0 °
Solid conductor (2) 0.5 mm² / 20 AWG
Strip length (2) 6 … 7.5 mm / 0.24 … 0.3 Inch
No. of poles 2
Total number of connection points 2
Total number of potentials 2
Number of connection types 1
Number of levels 1
Geometrical Data