Brochure/Catalogue
3
Efcient integration of device connectivity in the SMT process
With advanced products
Increasing requirements such as the demand for miniaturisation, higher functional
densities of modules and cost-effective manufacturing processes have led to
changes to PCB assembly processes. SMT (surface-mount technology) is thus
increasingly used in practice instead of the conventional through-hole technology
(THT). The SMT process has now established itself as the accepted standard in the
manufacture of electronic components.
The connection system can be integrated in the SMT process in two ways: by
means of THR (through-hole reow) or SMD (surface-mount device) technology.
Acombination of the two approaches is also possible.
4 Reliable PCB assembly with THR technology
6 Flexible device design with fully automated SMD installation
8 Product overviews
10 Design and processing recommendations
11 Services and support
Contents
As a leading supplier and pioneer of device connection technology, Weidmüller
offers the broadest range of products that is available for the SMT process. With
our THR and SMD connection components, we support highly efcient electronic
device manufacturing. Our connection elements are handled fully automatically
together with the component assembly in a single manufacturing process, which
reduces your manufacturing costs. In addition, we assist you throughout the
design-in process with products, in-depth knowledge of applications and proven
solutions expertise.
You will nd a detailed description
of the integration of OMNIMATE
device connection technology in the
SMT process in our White Paper –
see page 11.
THR components SMD components
In the through-hole reow process (THR), components
are inserted through a hole in the PCB and then soldered
to other SMT components. The special challenge of this
method is that the components need to withstand the
high temperatures of the SMT process.
In the SMT process, the surface-mounted devices (SMDs)
are soldered to the PCB with solder pads. The use of
SMD components means that it is possible to dispense
with wire pins to the components and with the holes
normally required for attachment to the PCB.