Making surface-mount technology faster and more efficient As device connection technology pioneers, we impress our customers with intelligent product details Let's connect.
Efficient integration of device connectivity in the SMT process With advanced products Increasing requirements such as the demand for miniaturisation, higher functional densities of modules and cost-effective manufacturing processes have led to changes to PCB assembly processes. SMT (surface-mount technology) is thus increasingly used in practice instead of the conventional through-hole technology (THT).
Reliable PCB assembly with THR technology With our dimensionally stable pin headers made of fibreglass-reinforced LCP Optimum solder pin length The pin length of 1.50 mm enables space saving, double-sided assembly of PCBs. At the same time, Weidmüller components meet all the requirements of IPC-A-610 E. Robust insulating body Thanks to MSL 1 (moisture sensitivity level 1), you can mount our THR components directly on the PCB without pre-drying.
Optimum solder pin length 1.5 mm With their short pin length of 1.50 mm, our components free up more space and allow greater design freedom, while meeting the requirements of IPC-A-610 E (7.3.3, Table 7-3, Note 1). With a PCB thickness of 1.60 mm, you benefit from double-sided assembly. The option of vapour-phase soldering is also available, since no drops of solder paste form on the underside of the circuit board.
Flexible device design with fully automatic SMD assembly OMNIMATE components combine connection efficiency with design freedom Reliable processing Thanks to the use of LCP, assembly can take place in the SMD process without pre-drying. The low expansion coefficient prevents assemblies from being deflected. Efficient assembly High component precision and low weight facilitate your assembly process. A high number of packing units per roll increases efficiency still further.
Reliable processing To maximise dimensional stability and ensure accurate grid alignment, we make our SMD components from the high-performance plastic LCP. This material offers high dimensional stability and excellent solder heat resistance. Our SMD connection system thus ensures a reliable, smooth SMD process. With their low moisture sensitivity level (MSL 1), you can process our components without predrying.
Product overview SMT PCB terminals and pin headers 8 LSF-SMT SL-SMT 3.5 SL-SMT 3.5/ ../ RF • 90°, 135° and 180° PCB connection types • All solder processes • Tape-on-reel and box packaging • Pitch sizes: 3.50/3.81/5.00/5.08/7.50/7.62 • Pin lengths: 1.5 mm and 3.2 mm • 90°, 135° and 180° PCB connection types • All solder processes • Tape-on-reel and box packaging • Enclosed version, screw flange or solder flange • Pin lengths: 1.5 mm and 3.
Product overview SMD PCB terminals LSF-SMD • 90°, 135° and 180° PCB connection types • SMT solder processes • Tape-on-reel and box packaging • Pitch sizes: 3.50/5.00/7.50 • Coplanarity ≤ 100 μm Flexible, robust and practical Conformity with standards and the consistently high level of quality of all electronic parts and components are among the key factors of success in product development, particularly in the industrial environment.
Design and processing recommendations With our expertise, you can realise your ideas efficiently For optimum soldering results in the SMT process we recommend the following parameters for our THR components: Pins Pin header Inner diameter of solder eyelet D [mm] Outer diameter of solder eyelet DA [mm] Stencil aperture diameter DSI [mm] Solder pin diameter d [mm] Solder pin length L [mm] S2C-SMT 3.50 & S2L-SMT 3.50 4–36 1.30+0,1 2.10 1.90 1.0, octagonal 1.50 SL-SMT 3.50 2–8 1.40+0,1 2.
Services and support Our offers around SMT technology and OMNIMATE device connectivity SMT White Paper Our device connection technology maximises design flexibility for devices and enables reliable and cost-optimised processes. Please find further information and details about how to optimally integrate our device connection technology into your SMT processes in our White Paper. Surface Mount Technology Integration of device connection technology in the SMT process Let’s connect Whitepaper www.
Weidmüller – Your partner in Industrial Connectivity As experienced experts we support our customers and partners around the world with products, solutions and services in the industrial environment of power, signal and data. We are at home in their industries and markets and know the technological challenges of tomorrow. We are therefore continuously developing innovative, sustainable and useful solutions for their individual needs. Together we set standards in Industrial Connectivity.
