Brochure/Catalogue
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Coplanarity:
To ensure reliable soldering quality in the manufacturing process, the contact surfaces of solder pins must
be wetted with the solder paste immediately after assembly. This allows the ux contained within the paste
to react with the Sn coating, resulting in a reliable soldering quality. The LSF-SMD has a coplanarity of up to
100 μm. We recommend a stencil thickness of 150 to 200 μm.
Product overview
SMD PCB terminals
Flexible, robust and practical
Conformity with standards and the consistently high level of quality of all electronic parts and components are
among the key factors of success in product development, particularly in the industrial environment. Our LSF-SMD
product family meets all of the requirements of PCB terminals in the industrial environment, the conditions of which
are simulated in our accredited laboratory.
LSF-SMD PCB terminals from Weidmüller were specically designed for soldering using the SMD reow process
and are able to withstand temperatures of up to 260 °C. The terminals full JEDEC requirements as regards process
sensitivity (PSL) and moisture sensitivity levels (MSL) with the highest rating class. Our LSF-SMD PCB terminals also
stand up to any comparison in terms of coplanarity, strength and vibration resistance. As such, they can easily be
integrated into all of the current production processes.
Mechanical stability:
Stability properties are covered by normative values as well as additional practical testing. The axial torque
per contact point (pole) is signicantly higher than the values permitted by the standard IEC 60947-7-4.
A clamping force per pole of around 150 N (40 N limit value for 1.5 mm² conductor cross-sections) in the
axial direction is many times higher than the normative requirements.
Vibration and shock resistance:
A simulated service life test is performed. The test spectrum includes increased broadband noise and shock in
accordance with IEC 61373/10.2011 with a category 1B severity level (“body mounted”) in the 5-to-150-Hz
frequency range and with an ASD level of 1.857 (m/s²)²/Hz 3 dB and an effective acceleration of 5.72 m/s² and
240 degrees of freedom (DOF). The test duration is ve hours per axis. The half-sine shock wave form has a
peak acceleration of 50 m/s² and a nominal duration of 30 ms.
max. 100 µm
F
5 – 150 Hz 5 G
LSF-SMD
• 90°, 135° and 180°
PCB connection types
• SMT solder processes
• Tape-on-reel and box packaging
• Pitch sizes: 3.50/5.00/7.50
• Coplanarity ≤ 100μm