Integration Manual

DT50RF (5127)
Integration Manual
Michael Aeschbacher
Doc.-Name: DT50RF_Integrator_Manual.docx, V1.3, Doc.-No.: 5127.30.316
Document date: 2020-05-06 – printed versions are uncontrolled copies!
© Neratec Solutions AG, CH-8608 Bubikon, Company Confidential
Page 3 (7)
Table of Contents
1 Labeling ........................................................................................................................................................... 4
1.1 The electronic label is accessible .............................................................................................................. 4
2 Module installation instructions ................................................................................................................... 5
2.1 General note .............................................................................................................................................. 5
2.2 Installation ................................................................................................................................................. 5
3 Regulatory Compliance ................................................................................................................................. 6
3.1 Applicable rules ......................................................................................................................................... 6
3.2 FCC Part 15, Class B ................................................................................................................................ 6
3.3 Industry Canada ........................................................................................................................................ 6
3.4 RF Exposure .............................................................................................................................................. 6
3.5 Professional Installation ............................................................................................................................ 7
3.6 Antennas ................................................................................................................................................... 7
3.7 Module Co-location .................................................................................................................................... 7
3.8 Host product testing ................................................................................................................................... 7