Datasheet

PN532_C1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.6 — 28 November 2017
115436 194 of 222
NXP Semiconductors
PN532/C1
Near Field Communication (NFC) controller
9. Limiting values
[1] The antenna should be tuned not to exceed this current limit (the detuning effect when coupling with
another device must be taken into account)
10. Recommended operating conditions
[1] V
SS
represents DV
SS
, TV
SS1
, TV
SS2
, AV
SS
.
[2] Supply voltage of VBAT below 3.3 V reduces the performance (e.g. the achievable operating distance).
[3] It is possible to supply PVDD=0V and to use the PN532 with reduced functionality (see Section 8.4 “
Power
management” on page 84)
11. Thermal characteristics
Table 290. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
PV
DD
Supply Voltage -0.5 4 V
V
BAT
Power Supply Voltage -0.5 6.0 V
P
tot
Total power dissipation 500 mW
I
TVDD
Maximum current in TVDD
[1]
150 mA
I
SVDD
Maximum current in SVDD switch 30 mA
V
ESD
Electrostatic discharge voltage
V
ESDH
ESD Susceptibility (Human Body model) 1500 , 100pF;
EIA/JESD22-A114-D
 2.0 kV
V
ESDM
ESD Susceptibility (Machine model) 0.75 mH, 200 pF;
EIA/JESD22-A115-A
200 V
V
ESDC
ESD Susceptibility (Charge Device model) Field induced model;
EIA/JESC22-C101-C
 1.0 kV
T
stg
Storage temperature -55 150 C
T
j
Junction temperature -40 125 C
Table 291. Operating conditions
Symbol Parameter Conditions Min Typ Max Unit
T
amb
Ambient Temperature -30 +25 +85 C
VBAT Power Supply Voltage V
SS
= 0 V
[1]
[2]
2.7 5.5 V
PV
DD
Supply Voltage for host interface V
SS
=0V
[3]
1.6 1.8 to 3.3 3.6 V
Table 292. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
thj-a
thermal resistance
from junction to ambient
in free air
with exposed pad soldered on a
4 layer Jedec PCB-0.5
37 41.1 K/W