SDIO PRODUCT SPECIFICATION IEEE 802.11 b/g/n 2.
Contents 1 .Change History of Revision......................................................................................................................................3 2. Overview....................................................................................................................................................................4 3. Features......................................................................................................................................................
Change History of Revision Revisio Date V1.
1.General Description The Realtek RTL8189FTV is a highly integrated single-chip 802.11n Wireless LAN (WLAN) network SDIO interface (SDIO 1.1/ 2.0 compliant) controller. It is a WLAN MAC, a 1T1R capable WLAN baseband, and WLAN RF in a single chip. The RTL8189FTV provides a complete solution for a high throughput performance integrated wireless LAN device.
2.Features General n CMOS MAC, Baseband PHY, and RF in a single chip for IEEE 802.11b/g/n compatible WLAN n Complete 802.11n solution for 2.4GHz band n 72.2Mbps receive PHY rate and 72.2Mbps transmit PHY rate using 20MHz bandwidth n 150Mbps receive PHY rate and 150Mbps transmit PHY rate using 40MHz bandwidth n Compatible with 802.11n specification n Backward compatible with 802.11b/g devices while operating in 802.11n mode Host Interface n Complies with SDIO 1.1/ 2.
3.PRODUCT SPECIFICATIONS Realtek RTL8189FTV. Functional Specifications Standards IEEE 802.11b, IEEE 802.11g, Draft IEEE 802.11n, IEEE 802.11d, IEEE 802.11e, IEEE 802.11h, IEEE 802.11i Bus Interface WiFi: GSPI/SDIO Media Access Control CSMA/CA with ACK Network Architecture Operating Channel Ad-hoc mode (Peer-to-Peer ) Infrastructure mode Scatter Net 11: (Ch. 1-11) – United States 13: (Ch. 1-13) – Europe 14: (Ch. 1-14) – Japan Frequency Range 2.400GHz ~ 2.
5.RF Electrical Specifications 1）RF Characteristics for IEEE802.11b ( 11Mbps mode unless otherwise specified) Items Contents Specification IEEE802.11b Mode CCK, DQPSK, DBPSK Data Rate 11, 5.5, 2, 1 Mbps Channel frequency 2412 ~ 2484 MHz RX -85 dBm (per≤-85dBm@8%) ±13ppm Freq Err Limit TX Characteristics Power Level Min Typ (17±2 dBm) EVM (<-18) 2）RF Characteristics for IEEE802.11g dBm -18 dB ( 54Mbps mode unless otherwise specified) Contents Specification IEEE802.
4）RF Characteristics for IEEE802.11n Items Contents Specification IEEE802.11n （MCS 0 to 7 for HT40MHz ） Mode 64 QAM, 16 QAM, QPSK, BPSK Data Rate 135 Mbps Channel frequency 2412 ~ 2484 MHz RX (per≤-65dBm@10%) -65 dBm Freq Err Limit ±13ppm TX Characteristics Power Level Min Typ (13±2 dBm) EVM (<-28) Max Unit 13 dBm -28 dB 6.Mechanical Dimensions (mm) Length Width Height 12.0 12.0 1.6 (Tolerance:±0.2mm) (Tolerance:±0.2mm) 8 / 16 (Tolerance:±0.
7.
Pin Definition Pin No.
34 CS Chip select，Activity high；Internal pull high to 3.3V at 100KΩ 35 NC NC 36 GND 37 NC NC 38 NC NC 39 NC NC 40 NC NC 41 NC NC 42 NC NC 43 NC NC 44 NC NC GND PIN1 The picture of top The picture of bottom 8.1 WIFI\BT RF Circuit reference pictures. 1. Above the dotted box part of the antenna matching is needed, the actual antenna matching electronic parameters shall prevail. 2.For RF part layout to do 50 ohm impedance. can't go on 90°of layout .
can't more than 20 mm. 8.2 SDIO interface Circuit reference pictures. 9.3 CS WAKE Reference circuits.
9 .Recommended Reflow Profile. Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : ≤2 times ID SETTING INFORMATION. Reg Domain World Wide 13 Channels 1-11 with active scan Channels 12,13 with passive scan Channel 14 with no scan Reg Domain Code 0x0A Vendor ID WiFi :0x024C Device ID WiFi :0x8179 Subsystem Device ID 0x8179 (Realtek demoboard) Subsystem Vendor ID 0x024C ENVIRONMENTAL.
Storage Temperature: Relevant Humidity: -10°C to +70°C (non-operating) 5-95% (non-condensing) MTBF caculation Over 150,000hours 10. RoHS compliance. This product is RoHS compliance. 12.Wifi 模块贴片装机前注意事项： 12.Wireless module before the SMT note: 1.When customers Open stencil must be sure the hole bigger to the Wireless module plate, please press 1 to 1 and 0.7 mm is widened to 1.客户在开钢网时一定要将 wifi 模块焊盘的孔开大，请按 1 比 1 再向外扩大 0.7mm 比例开钢网，厚度按 0.12mm. open outward, the thickness of 0.12 mm. 2.
2-2.Module apart packing after 168 hours，To launch patch need to bake, 2-3. 模块卷盘包装以客户要求的实际包装数量为准 to remove the module hygroscopic, baking temperature conditions： 125℃，8hours. 3.模块托盘包装事项如下： 2-3. The actual number of module reel packing which is based on the 3-1.保存期限：3个月，储存环境条件：温度在：<40℃， actual number of packages to the customer requirements. 相对湿度：<90%R.H. 3.Module pallet packaging items as follows： 3-1.Storage life ： 3 months. Storage conditions:<40℃ . Relative humidity:<90%R.H. 3-2.
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FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
transmitter that is not nomally required, the user has no access to the connector.Installation must be controlled. Installation requires special training This device complies with Part 15, Subpart C, Section 15.247 of the FCC Rules. RF warning for Mobile device: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
