User's Manual

3. 2 Installation Guidelines for Antenna PAD

The proper connection between the antenna pad and the application PCB

must be implementing the following installation guidelines for the layout of the application PCB.

a) The whole layer stack below the antenna connection pad should be free of digital lines.

b) Increase GND keep-out (i.e. clearance) around the antenna pad, on the top layer of the

application PCB, to at least 150 µm up to adjacent pads metal definition on the area below the

module, to reduce parasitic capacitance to ground.

c) Add GND clearance on the buried metal layer below the antenna pad,

to reduce parasitic capacitance to ground.

Figure 3. 2 GND clearance on top layer around antenna pad

Figure 3. 3 On the 2nd buried layer below antenna pad

When you intend to install this module(LTM100) with RF connector type,

please refer to the trace guideline figure below. (trace loss: max. 0.3dB)

Figure 3. 4 Trace guideline from the antenna pad to the RF connector pad