User's Manual

MODEL: DAUK-W12
Confidential. Wistron Neweb Corporation
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Contents
1. Product Introduction .................................................................................................. 4
2. Product Photograph ................................................................................................... 5
3. Functional Block Diagram ......................................................................................... 6
4. I/O Pin Definition ......................................................................................................... 6
5. Product Specification ................................................................................................. 7
5.1 Specifications ............................................................................................................................................ 7
5.2 EEPROM Information ............................................................................................................................... 12
6. Schematic.................................................................................................................... 13
7. PCB Layout ................................................................................................................. 14
7.1 Layer-1 (Top) ............................................................................................................................................ 14
7.2 Layer-2 ...................................................................................................................................................... 14
7.3 Layer-3 ...................................................................................................................................................... 14
7.4 Layer-4 (Bottom) ...................................................................................................................................... 14
8. Mechanical Dimension ............................................................................................... 15
8.1 Connector Dimension ............................................................................................................................... 15
8.2 Shielding cover Dimension ....................................................................................................................... 17
8.3 Module Dimension .................................................................................................................................... 18
9. Module Label Information .......................................................................................... 19
10. Packing Information ................................................................................................... 20
10.1 Packing Assembly ..................................................................................................................................... 20
10.2 Tray ........................................................................................................................................................... 21
10.3 Carton Label Information .......................................................................................................................... 22
11. BOM ............................................................................................................................. 23
12. Reliability and Environment specification................................................................ 25
13. Antenna Radiation Pattern......................................................................................... 27