User's Manual

Product datasheet
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Contents
Contact Information .......................................................................................................................... 2
Revision History ............................................................................................................................... 2
1 Product Features ...................................................................................................................... 6
1.1 Features Description ........................................................................................................... 6
2 Pin Definitions ......................................................................................................................... 8
2.1 LGA Module Pin Diagram .................................................................................................. 8
2.2 LGA Module Pin Definitions .............................................................................................. 8
3 Electrical Specifications ......................................................................................................... 12
3.1 Electrical Operating Conditions ........................................................................................ 12
3.1.1 Detailed Information .............................................................................................. 12
3.1.2 Power Tree ............................................................................................................. 12
3.2 Control Interfaces .............................................................................................................. 13
3.2.1 Power-on Signal (TBD) ......................................................................................... 13
3.2.2 Wake-up Interface (TBD) ...................................................................................... 13
3.2.3 Reset Signal ............................................................................................................ 14
3.3 UART Interface ................................................................................................................. 14
3.4 UIM Interface .................................................................................................................... 15
3.5 I/O Characteristics ............................................................................................................. 15
3.6 JTAG Interface .................................................................................................................. 17
3.7 Power Consumption .......................................................................................................... 17
3.8 RF Performance ................................................................................................................ 18
3.8.1 RF Pad Design ....................................................................................................... 18
3.8.2 RF Matching Guide ................................................................................................ 21
3.8.3 Interference and Sensitivity .................................................................................... 21
3.8.4 Band Support .......................................................................................................... 22
3.8.5 Bandwidth Support................................................................................................. 22
3.8.6 RF Transmission Specifications ............................................................................. 22
3.8.7 RF Receiver Specifications .................................................................................... 23
3.9 Temperature ...................................................................................................................... 23
3.10 LTE Power Saving Mode ................................................................................................ 23
3.11 Serial Number and IMEI ................................................................................................. 23
4 Mechanical Information ......................................................................................................... 25
4.1 Physical Dimensions ......................................................................................................... 25
4.2 Pin Dimensions ................................................................................................................. 25
4.3 Marking Information ......................................................................................................... 27
5 Packing Information............................................................................................................... 28
5.1 Packing Information .......................................................................................................... 28
5.2 Storage Conditions ............................................................................................................ 28
6 PCB Mounting Guidelines ..................................................................................................... 28
6.1 Mounting Considerations .................................................................................................. 28
7 Regulatory and Industry Approval ......................................................................................... 28
7.1 Certification Testing ......................................................................................................... 28