User's Manual
Table Of Contents
- Introduction
- Abbreviation
- Features
- Electrical Specifications
- Host interface pin assignments
- LGA Pad Diagram
- Pin Assignments
- Power supply
- USB interface
- SGMII interface
- UIM interface
- Control interface
- Power-on Signal
- Wake-up interface
- Reset Signal
- WWAN state Signal
- Digital interface
- JTAG Interface
- SPI Master Interface
- PCM Interface
- I2S Interface
- I2C Interface
- UART Interface
- ADC Interface
- RF Specifications
- RF connections
- Interference and sensitivity
- GNSS external circuit design
- RF Specification
- 3.5.1 Band support
- 3.5.2 Bandwidth support
- 3.5.3 RF Transmit Specification
- 3.5.4 RF Receiver Specification
- 3.5.5 GNSS Receiver Specification
- Power
- Power consumption
- Software Interface
- Support tools
- USB interface
- Mechanical and Environmental Certifications
- PCBA Form Factor
- Reflow
- PCB pad design
- Labeling
- SMT Voids control
- Mother board PCB thickness
- Stencil design
- Thermal considerations
- Regulatory Compliance and Certification
- Certification testing
- Packaging
- Tape-and-Reel Package
- Single Packaging for Samples
- MSL level
- Safety Recommendation
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HW Design Guidelines
Layout Suggestion: The 22μF, 0.1uF, 12pF and 8pF capacitors are required to place near
VCC pins as close as possible. Each power trace should possess
sufficient line width to withstand its respective current listed in the
table below:
Net Name
Current Value
VCC(1–2) total
2A
VCC(3) total
100mA
VCC(4–6) total
1A
UIM_VCC
150 mA
VREF
300 mA
2.3. USB interface
The M18QF/M18QA Series modules comply with USB 2.0 high-speed protocol. The USB
input/output lines follow USB 2.0 specifications.
Table 8. Signals of the USB interface
Name
Description
Input/Output
(Direction to module)
Voltage Level (V)
Min.
Typ.
Max.
D+
USB data positive (low-/full-speed)
Input High
2
3.3
3.6