User's Manual
Table Of Contents
- Introduction
- Abbreviation
- Features
- Electrical Specifications
- Host interface pin assignments
- LGA Pad Diagram
- Pin Assignments
- Power supply
- USB interface
- SGMII interface
- UIM interface
- Control interface
- Power-on Signal
- Wake-up interface
- Reset Signal
- WWAN state Signal
- Digital interface
- JTAG Interface
- SPI Master Interface
- PCM Interface
- I2S Interface
- I2C Interface
- UART Interface
- ADC Interface
- RF Specifications
- RF connections
- Interference and sensitivity
- GNSS external circuit design
- RF Specification
- 3.5.1 Band support
- 3.5.2 Bandwidth support
- 3.5.3 RF Transmit Specification
- 3.5.4 RF Receiver Specification
- 3.5.5 GNSS Receiver Specification
- Power
- Power consumption
- Software Interface
- Support tools
- USB interface
- Mechanical and Environmental Certifications
- PCBA Form Factor
- Reflow
- PCB pad design
- Labeling
- SMT Voids control
- Mother board PCB thickness
- Stencil design
- Thermal considerations
- Regulatory Compliance and Certification
- Certification testing
- Packaging
- Tape-and-Reel Package
- Single Packaging for Samples
- MSL level
- Safety Recommendation
52
/
71
HW Design Guidelines
6.2. Reflow
This section details the recommended reflow profile when the module is mounted onto
other boards.
Temp. Region
1
2
3
4
5
6
7
8
9
10
Upper temp. region
150
165
175
180
195
205
230
235
250
245
Lower temp. region
150
165
175
180
195
205
230
235
250
245
Conveyer band speed
95 cm/minute
PWI = 91%
D31-1
D31-2
D31-3
D31-4
Temp.
Difference
Preheat from 140–190°C
85.34
85.30
86.06
84.29
1.77
–12%
–13%
–8%
–18%
Melt-out Time/230°C
59.07
55.03
58.70
49.70
9.37
91%
50%
87%
–3%
Max Temp
244.27
243.56
244.33
242.71
1.62
43%
36%
43%
27%