User's Manual
Table Of Contents
- Introduction
- Abbreviation
- Features
- Electrical Specifications
- Host interface pin assignments
- LGA Pad Diagram
- Pin Assignments
- Power supply
- USB interface
- SGMII interface
- UIM interface
- Control interface
- Power-on Signal
- Wake-up interface
- Reset Signal
- WWAN state Signal
- Digital interface
- JTAG Interface
- SPI Master Interface
- PCM Interface
- I2S Interface
- I2C Interface
- UART Interface
- ADC Interface
- RF Specifications
- RF connections
- Interference and sensitivity
- GNSS external circuit design
- RF Specification
- 3.5.1 Band support
- 3.5.2 Bandwidth support
- 3.5.3 RF Transmit Specification
- 3.5.4 RF Receiver Specification
- 3.5.5 GNSS Receiver Specification
- Power
- Power consumption
- Software Interface
- Support tools
- USB interface
- Mechanical and Environmental Certifications
- PCBA Form Factor
- Reflow
- PCB pad design
- Labeling
- SMT Voids control
- Mother board PCB thickness
- Stencil design
- Thermal considerations
- Regulatory Compliance and Certification
- Certification testing
- Packaging
- Tape-and-Reel Package
- Single Packaging for Samples
- MSL level
- Safety Recommendation
53
/
71
HW Design Guidelines
Total Time/217°C
90.55
85.88
90.09
76.90
13.65
22%
4%
20%
–32%
Gradient1 (100–150°C)
1.91
1.83
1.93
1.78
0.15
27%
22%
29%
19%
Process limit:
Solder Paste
Lead-free
Profile feature
Min.
Max.
Unit
Gradient1 (Target = 1.5) (100 °C–150 °C)
(Time period = 20 s)
0
3
°C/S
Preheat time from 140 °C to 190 °C
70
105
S
Time maintained above 230 °C
40
60
S
Peak package body temperature
230
250
°C
Time maintained above 217 °C
60
110
S
6.3. PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads of the PCB on
which M18QF/M18QA Series modules will be mounted, this kind of design is good to
soldering reliability in SMT process.
Figure 22. NSMD solder pad design