User's Manual
Table Of Contents
- Introduction
- Abbreviation
- Features
- Electrical Specifications
- Host interface pin assignments
- LGA Pad Diagram
- Pin Assignments
- Power supply
- USB interface
- SGMII interface
- UIM interface
- Control interface
- Power-on Signal
- Wake-up interface
- Reset Signal
- WWAN state Signal
- Digital interface
- JTAG Interface
- SPI Master Interface
- PCM Interface
- I2S Interface
- I2C Interface
- UART Interface
- ADC Interface
- RF Specifications
- RF connections
- Interference and sensitivity
- GNSS external circuit design
- RF Specification
- 3.5.1 Band support
- 3.5.2 Bandwidth support
- 3.5.3 RF Transmit Specification
- 3.5.4 RF Receiver Specification
- 3.5.5 GNSS Receiver Specification
- Power
- Power consumption
- Software Interface
- Support tools
- USB interface
- Mechanical and Environmental Certifications
- PCBA Form Factor
- Reflow
- PCB pad design
- Labeling
- SMT Voids control
- Mother board PCB thickness
- Stencil design
- Thermal considerations
- Regulatory Compliance and Certification
- Certification testing
- Packaging
- Tape-and-Reel Package
- Single Packaging for Samples
- MSL level
- Safety Recommendation
55
/
71
HW Design Guidelines
Figure 23. Label drawing
6.5. SMT Voids control
6.5.1. Mother board PCB thickness
Thin mother board is prone to warping during SMT reflow, which creates voids when the
module is soldered. Therefore, the thickness of the mother board needs to be larger than
1.2 mm, and the larger the size of the mother board, the larger the thickness. For example,
1.4mm, 1.6mm.
6.5.2. Stencil design
The thickness of the stencil is at least 0.15 mm, and the thickness of the stencil need to be
increased depending on the actual situation. For example, there is open soldering still.