User's Manual
Table Of Contents
- Introduction
- Abbreviation
- Features
- Electrical Specifications
- Host interface pin assignments
- LGA Pad Diagram
- Pin Assignments
- Power supply
- USB interface
- SGMII interface
- UIM interface
- Control interface
- Power-on Signal
- Wake-up interface
- Reset Signal
- WWAN state Signal
- Digital interface
- JTAG Interface
- SPI Master Interface
- PCM Interface
- I2S Interface
- I2C Interface
- UART Interface
- ADC Interface
- RF Specifications
- RF connections
- Interference and sensitivity
- GNSS external circuit design
- RF Specification
- 3.5.1 Band support
- 3.5.2 Bandwidth support
- 3.5.3 RF Transmit Specification
- 3.5.4 RF Receiver Specification
- 3.5.5 GNSS Receiver Specification
- Power
- Power consumption
- Software Interface
- Support tools
- USB interface
- Mechanical and Environmental Certifications
- PCBA Form Factor
- Reflow
- PCB pad design
- Labeling
- SMT Voids control
- Mother board PCB thickness
- Stencil design
- Thermal considerations
- Regulatory Compliance and Certification
- Certification testing
- Packaging
- Tape-and-Reel Package
- Single Packaging for Samples
- MSL level
- Safety Recommendation
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HW Design Guidelines
Figure 24. Stencil-foil drawing
6.6. Thermal considerations
Grade
Operating
3GPP compliant
Functional work
Storage
Industrial
–40 °C~+85 °C
–20 °C~+60 °C
–40 °C~+85 °C
–40 °C ~+85 °C
Note: The temperature above refers to ambient temperature.
The case temperature of module shielding cover must be < 85 °C when integrated to
prevent damage.
Design points used to improve the thermal performance:
It’s better to add a naked copper area onto M18QF/M18QA Series modules’ back
side of the PCB. If the thermal performance becomes an issue in the customer’s
product, add thermal solutions for improvement such as a thermal pad or a heat
sink.
It’s recommended to have a thermal pad or a heat sink on shielding cover to help