User's Manual
Table Of Contents
- Introduction
- Abbreviation
- Features
- Electrical Specifications
- Host interface pin assignments
- LGA Pad Diagram
- Pin Assignments
- Power supply
- USB interface
- SGMII interface
- UIM interface
- Control interface
- Power-on Signal
- Wake-up interface
- Reset Signal
- WWAN state Signal
- Digital interface
- JTAG Interface
- SPI Master Interface
- PCM Interface
- I2S Interface
- I2C Interface
- UART Interface
- ADC Interface
- RF Specifications
- RF connections
- Interference and sensitivity
- GNSS external circuit design
- RF Specification
- 3.5.1 Band support
- 3.5.2 Bandwidth support
- 3.5.3 RF Transmit Specification
- 3.5.4 RF Receiver Specification
- 3.5.5 GNSS Receiver Specification
- Power
- Power consumption
- Software Interface
- Support tools
- USB interface
- Mechanical and Environmental Certifications
- PCBA Form Factor
- Reflow
- PCB pad design
- Labeling
- SMT Voids control
- Mother board PCB thickness
- Stencil design
- Thermal considerations
- Regulatory Compliance and Certification
- Certification testing
- Packaging
- Tape-and-Reel Package
- Single Packaging for Samples
- MSL level
- Safety Recommendation
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HW Design Guidelines
transfer heat.
If systems with M18QF/M18QA Series modules embedded intend to work under
ambient temperatures as low as -40°C, it’s suggested that:
1. SIM Card need to be well arranged to make sure it is functional at the
condition of ambient temperature as low as -40°C.
2. Adding heating circuit on board design, the circuit mainly consists of
temperature sensing unit, heating element and control unit.