User's Manual
Table Of Contents
- Introduction
- Abbreviation
- Features
- Electrical Specifications
- Host interface pin assignments
- LGA Pad Diagram
- Pin Assignments
- Power supply
- USB interface
- SGMII interface
- UIM interface
- Control interface
- Power-on Signal
- Wake-up interface
- Reset Signal
- WWAN state Signal
- Digital interface
- JTAG Interface
- SPI Master Interface
- PCM Interface
- I2S Interface
- I2C Interface
- UART Interface
- ADC Interface
- RF Specifications
- RF connections
- Interference and sensitivity
- GNSS external circuit design
- RF Specification
- 3.5.1 Band support
- 3.5.2 Bandwidth support
- 3.5.3 RF Transmit Specification
- 3.5.4 RF Receiver Specification
- 3.5.5 GNSS Receiver Specification
- Power
- Power consumption
- Software Interface
- Support tools
- USB interface
- Mechanical and Environmental Certifications
- PCBA Form Factor
- Reflow
- PCB pad design
- Labeling
- SMT Voids control
- Mother board PCB thickness
- Stencil design
- Thermal considerations
- Regulatory Compliance and Certification
- Certification testing
- Packaging
- Tape-and-Reel Package
- Single Packaging for Samples
- MSL level
- Safety Recommendation
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HW Design Guidelines
Feature list:
LTE 3GPP release 10 without Carrier Aggregation
M18QF/M18QA: 3GPP, LTE Cat. 4 with 150/50 Mbps for DL/UL
M14QF/M14QA: 3GPP, LTE Cat. 1 with 10/5 Mbps for DL/UL
Supports LTE B2/4/5/12/13/14
Supports WCDMA B2/5, 3GPP release 8
Ultra-high-performance Cortex A7 microprocessor
Modem subsystem (MSS)
Resource and power management (RPM) subsystem
Optimized for M2M and IoT markets
Interfaces
–
HS USB 2.0 with integrated PHY
–
SGMII interface
–
Dual UART interfaces (4 bit and 2 bit) for data transfer and diagnostic tools
–
SDC1/First SPI interface
–
I2C/Second SPI interface
–
USIM interface
–
GPIOs
–
ADC
–
PCM/I2S
–
JTAG interface