User's Manual

Product specification
18
6. APPLICATION DESIGN NOTES
6.1 Layout Notes
6.1.1 RF Pin Input Impedance Matching
Applications utilizing the module must ensure that a 50Ω controlled impedance trace is used. Shown in the
accompanying table are example calculations for a four- layer FR4 stack up and the resulting trace width for
Bluetooth RF input. The figure below illustrates the layer stack up for a four- layer board according to the
Description column in the table below.
Layer
Material
Type
Dielectric
Thickness
Trace
Width
Copper
Thickness
Dielectric
Constant
Char.
Impedance
Description
1
Conductive
-
27
2.1
-
50
Microstrip
Dielectric
16
-
-
4.3
-
Prepreg
2
Conductive
-
-
1.4
-
Plane
Dielectric
20
4.3
-
Prepreg
3
Conductive
-
-
1.4
-
-
Plane
Dielectric
16
-
-
4.3
-
Prepreg
4
Conductive
-
27
2.1
-
50
Microstrip
Table 6-1-1-1 Application Board Characteristic Impedance
Figure 6-1-1-1 Application Board Layer Stack Up
6.1.2 Handling Requirements
DO NOT TOUCH ANY Pad OF BTI MODULE WHILE ASSEMBLYING.
6.1.3 Soldering Requirements
Soldering Iron Soldering
Solder Temperature: 350oC
Immersion Duration: 2 ~ 3 seconds