WLAN/BT System Integration Manual WLAN/BT System Integration Manual Model Name: UMW‐WBT, CWM‐01 Project Code: Base Model: Issue Date: 2011/05/05 Rev Date: 2011/12/27 Rev:2 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
WLAN/BT System Integration Manual Revision History Rev. 1 2 History - Initial version Date 2011/05/05 1. Frequency range is changed to 2400‐2483.5Mhz 2. FCC channels revised to be ch1 – ch11 3. Power value is revised: WIFI: 15+/‐1.5dBm BT: class 1 - 2011/12/27 Author Shukai Hsu HT Liao Hauson Chen Chris WJ Huang Shukai The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
WLAN/BT System Integration Manual TABLE OF CONTENTS 1. INTRODUCTION ................................................................................................................................................................4 1.1 Product Overview.............................................................................................................................................................4 1.3 Standard Bluetooth Profiles......................................................................
WLAN/BT System Integration Manual 1. Introduction This document specifies the mechanical and electrical specifications for the 802.11b/g WiFi and Bluetooth 3.0 module. Continuing a tradition of design ingenuity and development, Wistron NeWeb Corporation (WNC) presents a standard modular solution for WiFi and Bluetooth technology to comply with OEM industrial requirements in vehicles. The module provides 802.11 b/g WLAN and Bluetooth 3.0 functions by using a single chipset solution.
WLAN/BT System Integration Manual Sensitivity: B Mode: –88dBm at 1Mbps –87dBm at 2Mbps –84dBm at 5.5Mbps –80dBm at 11Mbps G Mode: –82dBm at 6Mbps –81dBm at 9Mbps –79dBm at 12Mbps –77dBm at 18Mbps –74dBm at 24Mbps –70dBm at 36Mbps –66dBm at 48Mbps –65dBm at 54Mbps Media Access Protocol: CSMA/CA 802.11b data rates of 1, 2, 5.5 and 11 Mbps 802.11g data rates of 6, 9, 12, 18, 24, 36, 48, and 54 Mbps for multimedia content transmission 802.11e Quality of service (QoS) 802.11h transmit power control 802.
WLAN/BT System Integration Manual 1.3 Standard Bluetooth Profiles The standard Bluetooth profile is as Table 1‐2. Additional profiles other than lists are supported by 3’rd party. Operating System Bluetooth Profile GAP SDP GOEP A2DP Linux‐BlueZ HID HSP PAN OPP SPP SDP Windows Mobile A2DP HID HSP Table 1‐1 Standard Bluetooth Profiles 1.
WLAN/BT System Integration Manual 1.5 Module Pin Out 45 UART_CTS 40 35 30 GND VCC_3V0 GND GND VCC_3V3 VCC_3V3 VCC_1V8 GND SD_CLK SD_CMD SD_DATA[1] SD_DATA[0] SD_DATA[3] SD_DATA[2] GND UART_RTS UART_RX UART_TX The module is designed as 54 pin solder joint module for SMT process. The pin‐out is illustrated in the figure 1‐2.
WLAN/BT System Integration Manual 17 2 WLAN_RF BT_RF 5 BT_PCM_CLK/I2S_BCLK 7 BT_PCM_SYNC/I2S_LRCL K BT_PCM_DIN/I2S_DIN 4 I/O WLAN antenna in/out I/O Bluetooth antenna in/out Audio Interface – PCM/I2S I/O PCM clock / I2S audio bit clock I/O PCM sync pulse / I2S left/right clock I PCM data input / I2S data input (for recording) O PCM data output / I2S data output (for playback) Control & Power Interface I Reset signal Active low I Sleep clock Coexistence O Differential Antenna Select Positive output I
WLAN/BT System Integration Manual 34 26 VCC_1V8 VCC_VIO_X1 PO PI 9 VCC_VIO_X2 PI GND P 1, 3, 8, 10, 16, 18, 21, 22, 25, 27, 28, 30, 31, 35, 42 1.8V monitoring output 1.8/3.3V Host Interface Supply 3.3V Digital Interface supply Ground For SDIO, UART interface For PCM interface Table 1‐2 Pin Out Definition 1.6 Power management Module supply (VCC_3V3) 802.11b/g + Bluetooth modules must be supplied through VCC_3V3 pin by a DC power supply.
WLAN/BT System Integration Manual Operating condition Symbol Parameter VCC_3V3 Module power supply VIO_X1 Host interface digital I/O power supply VIO_X2 Digital I/O power supply VCC_3V0 1.8V internal voltage supply VCC_1V8 1.8V internal voltage supply TA Ambient operating temperature TJ Maximum junction temperature Condition Min 2.97 1.62 2.97 2.97 2.9 1.7 ‐40 Typ 3.3 1.8 3.3 3.3 3.0 1.8 Max 3.63 1.98 3.63 3.63 3.1 1.9 85 125 Units V V V V V V ℃ ℃ 1.
WLAN/BT System Integration Manual 2. Interfaces This chapter describes the interfaces on the WLAN/BT modules: SDIO, UART, PCM, JTAG, Antenna diagnosis. 2.1 SDIO Interface The module supports a SDIO device interface that conforms to the industry standard SDIO full speed card specification and allows a host controller using the SDIO bus protocol to access the WLAN and/or Bluetooth device. This device also supports high speed mode as defined in SDIO 1.2 specification.
WLAN/BT System Integration Manual SD_DAT_3 DAT3 I/O SDIO 4‐bit mode: Data line bit [3] SDIO 1‐bit mode: Not used SDIO SPI mode: Chip select (Negative true) 2.1.2 SDIO Connection/Function Figure 1.1 SDIO Physical Connection – 4 bit mode Note: In 4‐bit SDIO mode, data is transferred on all 4 data pins (DAT [3:0]), and the interrupt pin is not available for exclusive use as it is utilized as a data transfer line.
WLAN/BT System Integration Manual CTS Clear‐to‐Send input from the peripheral device. RTS Request‐to‐Send output to the peripheral device. 2.3 Digital Audio Interface Digital audio interfaces include PCM for voice application and I2S for digital stereo applications. PCM and I2S interface share the same pins. Voice interface supports. Hardware support for continual transmission and reception of PCM data without processor overhead. Standard PCM clock rates from 64KHz to 2.
WLAN/BT System Integration Manual Stereo audio mode: I2S_DIN, input 2.4 RESET# Reset signal, active low. The module is reset and the module begins the boot sequence when RESET# input pin transitions from low to high. 2.5 SLEEP_CLK SLEEP_CLK, clock input for external sleep clock. The sleep clock is used by the PMU during power save modes. 2.6 Joint Test Action Group (JTAG) and Test Interface JTAG is reserved for SW debug and failure analysis.
WLAN/BT System Integration Manual 2.7 Antenna Diagnosis If an external antenna equipped a 50Kohm from its RF cable core to GND, then this antenna diagnosis can check whether the antenna is plugged well or not. 2.7.1 VCC_BT_ANT_DIAG and BT_ANT_DIAG If an external antenna equipped a 50Kohm from its RF cable core to GND and a voltage V1 is applied to VCC_BT_ANT_DIAG, then BT_ANT_DIAG can be read as V1/2 if the connection of antenna and module is good. 2.7.
WLAN/BT System Integration Manual 3. Design‐In 3.1 Design‐in checklist This section provides a design‐in checklist. 3.1.1 Schematic checklist The following are the most important points for a simple schematic check: □ DC supply must provide a nominal voltage (3.3V) at VCC_3V3 pins above the minimum normal operating range limit. □ DC supply must provide a nominal voltage (3.3V) at VCC_VIO_X2 pins above the minimum normal operating range limit. □ DC supply must provide a nominal voltage (3.3V or 1.
WLAN/BT System Integration Manual 3.1.2 Layout checklist The following are the most important points for a simple layout check: □ Check 50 Ω impedance of ANT line (WLAN_RF, BT_RF). □ Follow the recommendations of the antenna producer for correct antenna installation and deployment. □ Ensure no coupling occurs with other noisy or sensitive signals. □ VCC line (VCC_3V3, VCC_VIO_X1, VCC_VIO_X2)should be wide and short. □ Route VCC supply line away from sensitive analog signals. □ Ensure proper grounding.
WLAN/BT System Integration Manual Rank 1st Function RF in/out 2nd DC Supply 3rd Ground Pin(s) BT_RF WLAN_RF VCC_3V3 VCC_VIO_X1 VCC_VIO_X2 GND Layout Very Important Very Important Remarks Design for 50 ohm characteristic impedance VCC lines should be short and wide. Route away from sensitive analog signals. Careful Layout provide proper grounding. Common Practice Follow common practice rules for digital pin routing.
WLAN/BT System Integration Manual case must be designed to achieve 50 Ω characteristic impedance. Microstrip lines are usually easier to implement and the reduced number of layer transitions up to antenna connector simplifies the design and diminishes reflection losses. However, the electromagnetic field extends to the free air interface above the stripline and may interact with other circuitry.
WLAN/BT System Integration Manual A tank capacitor with low ESR is often used to smooth current spikes. This is most effective when placed as close as possible to VCC. From main DC source, first connect the capacitor and then VCC. If the main DC source is a switching DC‐DC converter, place the large capacitor close to the DC‐DC output and minimize the VCC track length. Otherwise consider using separate capacitors for DC‐DC converter and WLAN/BT module tank capacitor.
WLAN/BT System Integration Manual interface require the same consideration regarding electro‐magnetic interference as for SDIO. Keep the traces short and avoid coupling with RF line or sensitive analog inputs. 3.2.2 Footprint and paste mask Figure 3‐2 and Figure 3‐3 describe the footprint and provide recommendations for the stencil for WLAN/BT modules. These are recommendations only and not specifications.
WLAN/BT System Integration Manual 3.2.3 Placement Optimize placement for minimum length of RF line and closer path from DC source for VCC. 3.3 Module thermal consideration The temperature increase of the main chip 88w8688, PA LX5511 and LDO MAX4835 on a WLAN/BT module mounted on a 168 x 46.45 x 1.3 mm FR4 PCB with a high coverage of copper (e.g. the EVK‐G25H evaluation kit) in still air conditions are less than 28℃, 25℃, 25℃ respectively. This is based on a worse case with full continuous WLAN TX mode.
WLAN/BT System Integration Manual Place antenna far from sensitive analog systems or employ countermeasures to reduce electromagnetic compatibility issues that may arise. 3.4.1 Antenna termination WLAN/BT modules are designed to work on a 50 Ω load. However, real antennas have no perfect 50 Ω load on all the supported frequency bands.
WLAN/BT System Integration Manual 4. Handling and Soldering 4.1 Packaging, shipping, storage and moisture preconditioning Handling Requirements DO NOT TOUCH ANY PIN OF WIFI MODULE WHILE ASSEMBLYING. Moisture preconditioning This WLAN/BT module meets MSL3. Please follow J‐STD‐033B to handle this module. 4.2 Soldering Requirements 4.2.1 Soldering Iron Soldering Solder Temperature: 350oC Immersion Duration: 2 ~ 3 seconds 4.2.
WLAN/BT System Integration Manual 4.2.3 Soldering Paste Use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning after the soldering process has taken place. The paste listed in the example below meets these criteria. Soldering Paste: ACS‐SN100C‐MA1 Alloy specification: Sn‐0.7Cu‐0.05Ni+Ge (99.2% Tin / 0.7 % Copper / 0.
WLAN/BT System Integration Manual 4.2.4 PCB Layout Footprint Design 4.2.4.1 Module Dimensions 4.2.4.2 PCB Layout Pad Design The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
WLAN/BT System Integration Manual 4.2.4.3 Stencil Design Stencil thickness : 0.10mm ~ 0.15mm. Solder paste thickness : 0.12mm ~ 0.18mm The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
WLAN/BT System Integration Manual 5 Product Testing 5.1 Production test WNC focuses on high quality for its products. All units produced are fully tested. Defective units are analyzed in detail to improve the production quality. This is achieved with automatic test equipment, which delivers a detailed test report for each unit.
WLAN/BT System Integration Manual Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
WLAN/BT System Integration Manual authority to operate this equipment. If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.
