User's Manual
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W
LAN/BT System Integration Manual
casemustbedesignedtoachieve50Ωcharacteristicimpedance.
Microstriplinesareusuallyeasiertoimplementandthereducednumberoflayertransitionsupto
antennaconnectorsimplifiesthedesignanddiminishesreflectionlosses.However,the
electromagneticfieldextendstothefreeairinterfaceabovethestriplineandmayinteractwith
othercircuitry.
Buriedstriplineexhibitsbettershieldingtoincomingandgeneratedinterferences.Thereforeare
preferredforsensitiveapplication.Incaseastriplineisimplemented,carefullycheckthatthevia
pad‐stackdoesnotcouplewithothersignalsonthecrossedandadjacentlayers.
Minimizethetransmissionlinelength;theinsertionlossshouldbeminimizedasmuchaspossible,
intheorderofafewtenthsofadB.
ThetransmissionlineshouldnothaveabruptchangetothicknessandspacingtoGND,butmustbe
uniformandroutedassmoothlyaspossible.
ThetransmissionlinemustberoutedinasectionofthePCB whereminimalinterferencefrom
noisesourcescanbeexpected.
RouteANTlinefarfromothersensitivecircuitsasitisasourceofelectromagneticinterference.
AvoidcouplingwithVCCroutingandanalogaudiolines.
EnsuresolidmetalconnectionoftheadjacentmetallayeronthePCBstack‐uptomainground
layer.
AddGNDviasaroundtransmissionline.
Ensurenoothersignalsareroutedparalleltotransmissionline,orthatothersignalscrosson
adjacentmetallayerIfthedistancebetweenthetransmissionlineandtheadjacentGNDarea(on
thesamelayer)doesnotexceed5timesthetracewidthofthemicrostrip,usethe“Coplanar
Waveguide”modelfor50Ωcharacteristicimpedancecalculation.
Don’troutemicrostriplinebelowdiscretecomponentorothermechanicsplacedontoplayer.
Whenterminatingtransmissionlineonantennaconnector(orantennapad)itisveryimportantto
strictlyfollowtheconnectormanufacturer’srecommendedlayout.
GNDlayerunderRFconnectorsandclosetoburiedviasshouldbecutoutinordertoremovestray
capacitanceandthuskeeptheRFline50Ω.Inmostcasesthelargeactivepadoftheintegrated
antennaorantenna
connectorneedstohaveaGNDkeep‐out(i.e.clearance)atleastonfirstinner
layertoreduceparasiticcapacitancetoground.Notethatthelayoutrecommendationisnot
alwaysavailablefromconnectormanufacturer:e.g.theclassicalSMAPin‐Through‐Holeneedsto
haveGNDclearedonallthelayersaround
thecentralpinuptoannularpadsofthefourGNDposts.
Check50ΩimpedanceofANTline.
3.2.1.2MainDCsupplyconnection
TheDCsupplyofWLAN/BTmodulesisveryimportantfortheoverallperformanceandfunctionality
oftheintegratedproduct.
VCCconnectionmaycarryamaximumburstcurrentintheorderof0.5A.Therefore,itistypically
implementedasawidePCBlinewithshortroutingfromDCsupply(DC‐DCregulator,batterypack,
etc)
EachvoltagedropintheDCsupplytrackwillrestricttheoperatingmarginatthemainDCsource
output.Therefore,the
PCBconnectionhastoexhibitaminimumorzerovoltagedrop.Avoidany
seriescomponentwithEquivalentSeriesResistance(ESR)greaterthanafewmΩ.
Giventhelargeburstcurrent,VCClineisasourceofdisturbanceforothersignals.Thereforeroute
VCCthroughaPCBareaseparatedfrom
sensitiveanalogsignals.Typicallyitisgoodpracticeto
interposeatleastonelayerofPCBgroundbetweenVCCtrackandothersignalrouting.
TheVCCsupplycurrentsupplyflowsbacktomainDCsourcethroughGNDasgroundcurrent:
provideadequatereturnpathwithsuitableuninterruptedgroundplanetomainDCsource.