User's Manual
Table Of Contents
- Introduction
- Modules RF band support
- Features
- Module Connection Interface
- Environmental Specifications and Certifications
- Environmental Specifications
- Certifications
- Green Product Compliance
- Pin Definitions
- LGA Module Pin Diagram
- LGA Module Pin Definitions
- Electrical Specifications
- Power supply
- Power consumption
- I/O Interface
- USB interface
- UIM interface
- Control interface
- Power-on/ WAKEUP_IN Signal
- WAKEUP_OUT interface
- Reset Signal
- SPI Master Interface
- PCM Interface
- I2S Interface
- I2C Interface
- UART Interface
- ADC Interface
- RF Specifications
- Band support
- Bandwidth support
- RF Transmit Specification
- RF Receiver Specification
- GNSS Receiver Specification
- Software Interface
- Support tools
- USB interface
- Mechanical
- PCBA Form Factor
- Design Guide
- Power supply
- Thermal design
- USB design
- RF connection
- Interference and sensitivity
- GNSS external circuit design
- Reflow
- PCB pad design
- Stencil
- Antenna design requirement
- Labeling and Packaging
- Labeling
- Packing
- MSL level
- Safety Recommendation
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Product Technical Specifications
□ Normal □ Internal Use Confidential □ Restricted Confidential
Figure 22. NSMD solder pad design
It is not recommended to place via or micro-via not covered by solder resist in an area of
0.3 mm around the pads unless it carries the same signal of the pad itself, see following
figure.
Holes in pad are allowed only for blind holes and not for through holes.
6.9. Stencil
0.15mm stencil-foil thickness is recommended to obtain the best performance to prevent
voids during SMT reflow, 0.12mm is the minimum requirement if there is any
restrictions.