Instructions

9 Manufacturing information
9.1 Moisture sensitivity level
The sensor product is categorized as JEDEC Moisture Sensitivity Level 3 (MSL3), which re-
quires special handling.
More information regarding the MSL requirements can be found in the IPC/JEDEC J-STD-020
standard on www.jedec.org. More information about the handling, picking, shipping and the
usage of moisture/re-flow and/or process sensitive products can be found in the IPC/JEDEC
J-STD-033 standard on www.jedec.org.
9.2 Soldering
9.2.1 Reflow soldering
Attention must be paid on the thickness of the solder resist between the host PCB top
side and the modules bottom side. Only lead-free assembly is recommended according
to JEDEC J-STD020.
Profile feature Value
Preheat temperature Min T
S Min
150°C
Preheat temperature Max T
S Max
200°C
Preheat time from T
S Min
to T
S Max
t
S
60 - 120 seconds
Ramp-up rate (T
L
to T
P
) 3°C / second max.
Liquidous temperature T
L
217°C
Time t
L
maintained above T
L
t
L
60 - 150 seconds
Peak package body temperature T
P
see table below
Time within 5°C of actual preak temperature t
P
20 - 30 seconds
Ramp-down Rate (T
P
to T
L
)* 6°C / second max.
Time 20°C to T
P
8 minutes max.
Table 22: Classification reflow soldering profile, Note: refer to IPC/JEDEC J-STD-020E
* In order to reduce residual stress on the sensor component, the recommended
ramp-down temperature slope should be lower than 3°C /s.
Differential Pressure Sensor, Part Nr. 25131308xxx01
User manual version 1.0 © August 2019
www.we-online.com/sensors 32