Datasheet

ManualsBrandsWürth Elektronik ManualsCapacitorsWCAP-CSMH Ceramic Capacitor NP0 1nF 1kV 1210

Dimensions: [mm]

Properties Value Unit Tol.

Length L 3.2 mm ±0.3

Width W 2.5 mm ±0.2

Height H 1.6 mm ±0.2

Pad Dimension Fl 0.75 mm ±0.25

pl1 - Reflow 4 mm pl2 - Reflow 2.2 mm fw - Reflow 2.5 mm

Recommended Land Pattern: [mm]

pl2

pl1

Schematic:

Properties Test conditions Value Unit Tol.

Capacitance 1 ±0.2 V

RMS

, 1 MHz ±10% @25 °C C 1 nF ±5%

Rated Voltage U

1000 V (DC) max.

Q-factor 1 ±0.2 V

RMS

, 1 MHz ±10% @25 °C Q 1000 min.

Insulation

Resistance

Apply 500 V for 60 s max. R

ISO

10 GΩ min.

Electrical Properties:

Precondition for Class II MLCC measurement: Apply a preheat treatment @150 ±10 °C for 1 hour.

The measurement should be applied after 24 ±2 hrs the part was stored under ambient conditions.

There is not any precondition necessary for Class I MLCC.

Mid & High Voltage MLCC

Ceramic Type NP0 Class I

Temperature Coeffecient ± 30 ppm max.

Storage Conditions 5-35 °C, < 75% RH

Operating Temperature -55 °C up to +125 °C

Dielectric Strength 15 sec. @120 % U

; Charge & Discharge Current <50 mA

Test conditions of Electrical Properties: +20°C, 35% RH if not specified differently

FIT according to separate documentation

Component conform to REACh and RoHS requirements and standards

General Information:

Würth Elektronik eiSos GmbH & Co. KG

EMC & Inductive Solutions

Max-Eyth-Str. 1

74638 Waldenburg

Germany

Tel. +49 (0) 79 42 945 - 0

www.we-online.com

eiSos@we-online.com

CREATED CHECKED GENERAL TOLERANCE PROJECTION

METHOD

KaS PSL DIN ISO 2768-1m

DESCRIPTION TECHNICAL REFERENCE

WCAP-CSMH Ceramic Capacitors

NP01210102JA00DFCT10000

ORDER CODE

885342009003

SIZE REVISION STATUS DATE (YYYY-MM-DD) BUSINESS UNIT PAGE

1210

001.000 Valid 2016-09-19 eiCap 1/7

This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH

& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety

must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.

Summary of content (7 pages)

PAGE 1
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Test conditions Capacitance 1 ±0.2 VRMS, 1 MHz ±10% @25 °C Rated Voltage pl1 pl2 fw Fl Q-factor 1 ±0.2 VRMS, 1 MHz ±10% @25 °C Insulation Resistance Apply 500 V for 60 s max. Value Unit Tol. C 1 nF ±5% UR 1000 V (DC) max. Q 1000 min. RISO 10 GΩ min. Precondition for Class II MLCC measurement: Apply a preheat treatment @150 ±10 °C for 1 hour.
PAGE 2
Mechanical Properties: Properties Termination Adhesice Strength of Termination Definition Cu/ Ni/ Sn ≤ 0603 > 0603 Vibration Resistance Resistance to Solder Heat 10 ±1 sec; 5 N 10 ±1 sec; 10 N all 3 directions, 2 hours each @ 10 - 50 Hz/ min., amplitude 0.75 mm or 10 g Specific Refer to Soldering Profile Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel.
PAGE 3
Classification Reflow Profile for SMT components: Classification Reflow Soldering Profile: Profile Feature Tp tp Max. Ramp Up Rate Max. Ramp Down Rate TL Temperature Ts max TC –5°C Ts min 150 °C Preheat Temperature Max Ts max 200 °C Preheat Time ts from Ts min to Ts max ts Ramp-up Rate (TL to TP) Ts min 60 - 120 seconds 3 °C/ second max.
PAGE 4
Classification Wave Soldering Profile: Classification Wave Soldering Profile: Profile Feature tp Tp Preheat Temperature Min Preheat Temperature Typical First Wave Second Wave Preheat Temperature Max Sn-Pb Assembly 100 °C 100 °C Ts typical 120 °C 120 °C Ts max 130 °C 130 °C ts 70 seconds 70 seconds Ramp-up Rate ΔT 150 °C max. 150 °C max. Peak temperature Tp 250 °C - 260 °C 235 °C - 260 °C Time of actual peak temperature tp max. 10 seconds max. 5 seconds each wave max.
PAGE 5
Cautions and Warnings: 2.03 Operating load conditions The following conditions apply to all goods within the product series of WCAP-CSMH of Würth Elektronik eiSos GmbH & Co. KG: • Do not use the capacitor with any higher than specified voltage. • Violation of the technical product specifications such as exceeding the specified voltage will void the warranty.
PAGE 6
• Do not use too much adhesive to avoid pollution of the soldering pads. 2.09 Coating, molding and potting of the P.C. board 2.07 Soldering • • • • • • • • • • • The detailed soldering instructions for reflow and wave soldering are given within Soldering Specification in the datasheet. The soldering profile has to be compliant with the technical soldering specification, otherwise this will void the warranty. Avoid any other than specified temperature and / or time conditions during soldering.
PAGE 7
Important Notes 6. Product Life Cycle The following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG: Due to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance.