Datasheet

• Do not use too much adhesive to avoid pollution of the soldering pads.
2.07 Soldering
• The detailed soldering instructions for reflow and wave soldering are given within Soldering Specification in the datasheet.
• The soldering profile has to be compliant with the technical soldering specification, otherwise this will void the warranty.
• Avoid any other than specified temperature and / or time conditions during soldering.
• Customer needs to ensure that the applied solder paste, the paste thickness and solder conditions are applicable to guarantee a
sufficient solder result according to the relevant criteria of IPC-A-610.
• Excessive amount of solder may lead to higher tensile force and chip cracking. Insufficient amount of solder may detach the capacitor
due to defective contacts.
• Do not use excessive nor insufficient flux.
• Provide enough washing when water-soluble flux is used.
• Consider the preheating conditions as follows to avoid thermal shock:
1. Wave soldering - 0603, 0805 - Temperature difference ΔT ≤ 150°C
2. Reflow soldering - 1206 or less - Temperature difference ΔT ≤ 190°C
3. Reflow soldering - 1210 or more - Temperature difference - ΔT ≤ 130°C
4. Manual soldering - 1206 or less - Temperature difference ΔT ≤ 190°C
5. Manual soldering - 1210 or more - Temperature difference ΔT ≤ 130°C
• It is recommended to use air for natural cooling. When dipping the chips into a solvent for cleaning, the temperature difference (∆T)
must be less than 100°C.
• For reflow soldering two times limitation is recommended.
• Wave soldering is recommended only for the following case sizes: 0603 and 0805, thickness
• Please ensure for manual soldering (solder iron) not to exceed the general temperature capabilities as specified above.
• The following conditions are recommended for solder repair by solder iron:
• Size Temp. (°C) Preheating Temp. (°C) Temperature difference (ΔT) Atmosphere
• 1206 or less 330 ± 20°C >150°C ΔT ≤ 190°C
• 1210 or more 280°C max >150°C ΔT ≤ 130°C Room air
Typical time of actual peak temperature:
Do not make direct contact with the ceramic dielectric.
2.08 Cleaning
• Cleaning agents that are used to clean the customer application might damage or change the characteristics of the component, body,
pins or termination.
• Avoid Halogen in the flux or any contaminated flux as well as excessively high ultrasonic cleaning.
2.09 Coating, molding and potting of the P.C. board
• When coating and molding the P.C. board verify the quality influence on the capacitor.
• Verify the curing temperature and assure that there is no harmful decomposing or reaction gas emission during curing.
• Do not exceed the maximal temperature rise of 20°C.
• If the product is potted in customer applications, the potting material might shrink during and after hardening. The product is exposed to
the pressure of the potting material with the effect that the body and termination is possibly damaged and so the electrical as well as
the mechanical characteristics are endangered to be affected. After the potting material is cured, the body and termination of the
product have to be checked if any reduced electrical or mechanical functions or destructions have occurred.
2.10 Handling after chip is mounted
• Direct mechanical impact to the product shall be prevented.
• After soldering please pay attention not to bend, twist or distort the P.C. board in handling and storage.
• Avoid excessive pressure during the functional check of the P.C. board.
• Avoid bending stress while breaking the P.C. board.
2.11 Handling of loose chip capacitor
• Once dropped do not use the chip capacitor.
• After mounting avoid piling up P.C. boards to avoid hitting the chip capacitor of another board.
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. [phone] - 0
www.we-online.com
[e-mail]
CREATED CHECKED GENERAL TOLERANCE PROJECTION
METHOD
KaS PSL DIN ISO 2768-1m
DESCRIPTION TECHNICAL REFERENCE
WCAP-CSMH Ceramic Capacitors
NP01210102JA00DFCT10000
ORDER CODE
885342009003
SIZE REVISION STATUS DATE (YYYY-MM-DD) BUSINESS UNIT PAGE
1210
001.000 Valid 2016-09-19 eiCap 6/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.