Product Description

Xiaomi Communications Co., Ltd.
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3.3 Reflow temperature curve
Figure 3-1. MHCWB4P-IB Reflow temperature curve
Soldering instructions: In double-sided SMT, after the T-side (top side) components are
reflowed for the first time, the circuit board needs to be flipped and reflow soldered on
the other side. In the second reflow, the already soldered T-side components will be fixed
by the surface tension of the solder paste to prevent the components from dropping under the
effect of gravity.
The design of the mother board and the yin and yang board are over-furnaceed (furnace
temperature 240-260℃) and verified that there is no defect. To ensure its stability, it is
recommended to dispense.