User Manual

B: Hot air function option

OPERATING PRECAUTIONS

1. Make sure both heater and nozzle are cool before attaching the nozzle.

2. Caution High Temperature Operation

Both nozzle and hot air are extremely hot and can cause burns. Never touch the

nozzle and heater assembly or allow the hot air to blow against your skin. Initially,

the iron may emit white smoke, but this will soon dissipate.

3. Be sure to cool the unit after using. While the power switch off, the unit will

automatically blow cooling air through the pipe for a short period of time. Do not

disconnect the plug during this cooling process.

4. Do not disassemble the pump.

If the pump or other critical internal components become faulty, discontinue its use

immediately. Please return to your vendor or its authorized repairers for proper servicing.

5. Disconnect the plug while the unit is not in use.

When the power cord is connected into the power supply, the unit has a little flow

of electricity; even the Power Switch is in off position. So when you don’t use the

unit for a longer period of time, disconnect the plug.

Operation Setup

1. Select the Nozzle that matches the size of the IC. Attach the nozzle when both

heating element and the nozzle are cool and the unit is turned off and unplugged.

2. Loosen the screw on the nozzle and attach nozzle.

3. Press “▲” or“▼”key on the hot air function panel to choose the desired

temperature or air flow.

4. Press “▲”or “▼” key to choose the desired air flow on the right side of the front

panel. The speed will change 5 degrees by pressing the keys “▲” or“▼” at a time.

5. After adjusting the air flow and temperature and wait for the temperature to

stabilize for a short period of time.

IMPORTANT: Do not force the nozzle or pull on the edge of the nozzle with pliers.

Also, do not tighten the set-screw too tightly.

Suitable for desoldering of SMD components such as SOIC, CHIP, QFP, PLCC,

BGA etc.

QFP De-soldering