Datasheet

Manual Soldering
Reflow soldering for chip capacitors
(1) For reflow, use a thermal conduction system such as infrared radiation (IR) or hot blast. Vapor heat transfer systems
(VPS) are not recommended.
(2) Pbserve proper soldering conditions(temperature, time, etc.). Do not exceed the specified limits.
(3) Reflow shoud be performed one time. Consult us for additional reflow restrictions.
(4) Reflow soldering profile for standard :
(5) Reflow soldering profile for lead free :
(2) Do not use the capacitor as a handle when moving the circuit board assembly.
(3) Avoid striking the capacitor after assembly to prevent failure due to excessive shock.
(1) Observe temperature and time soldering specifications or do not exceed temperatures of 300 for 3 seconds or less.
(2) If a soldered capacitor must be removed and reinserted , avoid excessive stress on the capacitor leads.
Capacitor handing after soldering
(1) Avoid moving the capacitor after soldering to prevent excessive stress on the lead wires where they enter the seal.