Datasheet

YZ-WS5N40N

Soldering Conditions - Lamp Type LED

 Solder the LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base of the tie

bar is recommended

 Recommended soldering conditions

Dip Soldering

Pre-Heat

Pre-Heat Time

Solder Bath Temperature

Dipping Time

Dipping Position

100 Max.℃

60 sec. Max.

260 Max.℃

5 sec. Max.

No lower than 3mm from the base of the epoxy bulb.

Hand Soldering

3Ø Series Others (Including Lead-Free Solder)

Temperature

Soldering time

Position

300 Max.℃

3 sec. Max.

No closer than 3mm from

the base of the epoxy bulb.

350 Max.℃

3 sec. Max.

No closer than 3mm from

the base of the epoxy bulb.

 Do not apply any stress to the lead, particularly when heated

 The LEDs must not be repositioned after soldering

 After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the

LEDs return to room temperature.

 Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be caused by the

PC board warping or from the clinching and cutting of the leadframes. When it is absolutely necessary, the

LEDs may be mounted in this fashion, but, the User will assume responsibility for any problems. Direct

soldering should only be done after testing has confirmed that no damage, such as wire bond failure or

resin deterioration, will occur. YOLDAL’s LEDs should not be soldered directly to double sided PC boards

because the heat will deteriorate the epoxy resin.

 When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the

mechanical stress on the LEDs.

 Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause

LED failure.