Yuga NB module hardware manual V1.01
Table Of Contents
- Chapter 1. Introduction
- Chapter 2. Review of modules
- Chapter 3. Interface application description
- Chapter 4. RF overall technical index
- Chapter 5. Electrical characteristics of interface
- Chapter 6. Structure and mechanical properties
- Chapter 7. Production and packaging
- Chapter 8. Terminology abbreviation
LPM2100 mg NB module hardware manual
Shang Hai YUGE Information Technology co., LTD
Page
38
of
39
Figure 7-1 reflow soldering temperature curve
Table 7-1 recirculation process parameter table
Temperature zone
time
key parameter
Preheating zone
（
40S
℃
-165
℃）
heating rate
：
1
℃
/s-3
℃
/s
Isothermal zone
（
160
℃
-210
℃）
(t1
～
t2)
：
70s-120s
Reflux zone（> 217℃）
(t3～t4)：40s-60s
Peak temperature：235℃-245℃
Cooling zone
cooling rate：2℃/s ≤ Slope ≤ 5℃/s