Specifications

YG-1540001/2 HARDWARE SPECIFICATION
TNS21252 Rev1.0
12
８．Production Flow
Solder Print
Mounting of electronic components
Components Mount
Re-Flow
Aspect Inspection
Inspect about the condition of the PCB
Splitting PCB
Split the sheet of the PCB
Wire Assemble※
Wire Assemble
Wire Aspect Inspect※
Inspect about the condition of the Wires.
Test
Function Test
Final Aspect inspect
Inspect about the final production.
Packing
Packing
※YG-1540002 Only
９．Function Test
YG-1540001
Test Item Content
Insulation Resistance Over 10kΩ
Voltage 3.3V±5％
Writing Firmware Success or Frailer
RFID Communication Test 5～65mm No Re-try
YG-1540002
Test Item Content
Insulation Resistance Over 10kΩ
Voltage 3.3V±5％
Writing Firmware Success or Frailer
RFID Communication Test 5～45mm No Re-try
Photo Sensor Success or Frailer