Specifications

ManualsBrandsZhejiang Lierda Internet of Things technology ManualsElectronicsBluetooth Module

1 / 15

LSD4BT-K53x

K53BLEmesh Standard Module (PCB Antenna)

K53 series of low-power Bluetooth module is a high-performance Bluetooth module which is

developed based on the Telink low-power Bluetooth SOC TLSR8250 chip. The module adopts the

stamp-type and side plug-in interfaces, is exquisite and compact, is fully lead out via ports and convenient

to use, and helps the users omit the complicated RF hardware design, development and production links.

Therefore, the users can easily realize the development of Bluetooth application programs on that basis,

shorten the R&D cycle, and seize the market opportunities. This model is a pure hardware module that

excludes any software. If you need the edition with software, please notify in advance.

Product Characteristics

·Working Frequency Band

- Working frequency band: 2402-2480MHz

·Ultra-low Power Consumption

- Support 2.7V-3.6V power supply

- Emission current: ≤20mA (10dBm power

configuration)

- Receiving current: ≤7.5mA (overall current)

- Sleep current: 400nA (SRAM not saving)

·High-link Budget

- Sensitivity-96dBm±1dBm (1Mbps, PER<30.8%)

- Emission power: Max.12dBm

·Memory Resources

- Internal 512kB Flash (the capacity that

the client can actually use is less than

512kB)

- 48kB on-chip SRAM, wherein 32kB can

sleep and save

·Compatibility

- Designed interface mode with side

plug-in and stamp holes compatible

·Mesh Functions

- Support BLE

- Support the Bluetooth SIG Mesh

- Support the exclusive Mesh of Telink

·Communication Interface

- 2 PWM / 4 GPIO / 1 UART （ Pin

multiplexing）

Applicable Scenes

- Smart phone and tablet peripherals;

- Bluetooth remote control;

- Sports and health tracking, health care;

- Wearables;

- Smart light control, smart home, smart

city;

- Logistics transportation tracking;

- Consumer electronics;

- Building automation

- Industrial control

Summary of content (15 pages)

PAGE 1
LSD4BT-K53x K53BLEmesh Standard Module (PCB Antenna) K53 series of low-power Bluetooth module is a high-performance Bluetooth module which is developed based on the Telink low-power Bluetooth SOC TLSR8250 chip. The module adopts the stamp-type and side plug-in interfaces, is exquisite and compact, is fully lead out via ports and convenient to use, and helps the users omit the complicated RF hardware design, development and production links.
PAGE 2
Thanks for choosing Lierda products. Please read through this Manual before using the products. By using the products, you have understood and accept the terms and instructions in this Manual. Lierda Science & Technology Co., LTD reserves all legal rights to revise and explain the terms and information provided, without prior notices. Zhejiang Lierda IoT Technology Co., Ltd provides this document to support the product design of users.
PAGE 3
ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES  The OEM must certify the final end product to comply with unintentional radiators (FCC Sections 15.107 and 15.109) before declaring compliance of the final product to Part 15 of the FCC rules and regulations. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change.  The OEM must comply with the FCC labeling requirements.
PAGE 4
CONTENTS .................................................................................................................. 1 Specifications & Parameters 5 2 Dimensional Drawing and Pin Definitions........................................................................................... 5 2.1 Dimensional Drawing................................................................................................................. 6 2.2 Pin Definitions...............................................................
PAGE 5
1 Specifications & Parameters Table 1-1 Limit Parameters of Module Performance Parameters Remarks Min Max Supply voltage （V） -0.3 +3.6 Max voltage of input pins -0.3 VDD+0.3 Storage temperature（℃） -65 150 All AVDD and DVDD with same voltages Table 1-2 Working Parameters1 of Module Parameters Performance Remarks Min TYP Max Supply voltage（V） 2.7 3.3 3.6 Work temperature（℃） -40 - 85 -30 - +30 Below 25℃ 2.402 - 2.
PAGE 6
P1 P26 P10 P11 P26 P1 P17 P10 P16 P16 P11 Fig. 2-1 Physical Diagram of LSD4BT-K53ASTD001 * When this product is being designed, the resistance capacitor and PCB have optional material models, so their colors of appearance may be different on the premise that the performance requirements are met, and shall be subject to the physical products; the main materials (main chip, crystal oscillator, etc.) do not have substitute models, and any change of them will be notified in advance. 2.
PAGE 7
2.2 Pin Definitions Table 2-1 Pin Definitions2 PIN Pin Name Description P1 GND Ground P2 ANT RF signal/ANT P3 GND Ground P4 RST Power on reset ,active low P5-P13 NC P14 SWS/UART_RTS/PA<7> Single wire slave / UART_RTS / GPIO PA[7] P15 GND Ground P16 VCC 3.3V power supply for module internal circuit P17 VCC 3.
PAGE 8
3 Basic Operations 3.1 Pins When using the module, please choose the IO pin and carry out single-wire burning to the module according to the actual application. It is suggested leaving VCC, GND and SWS on the bottom plate for burning. Fig. 3-1 Typical Application Circuits 3.2 Notices to Hardware Layout 1． Try to shorten the wire from the RF outlet to the antenna pad, lay the 50Ω impedance wire, surround the wire with copper foil which is grounded, and form as many as possible through holes around the wire.
PAGE 9
Scheme 1: The PCB antenna is outside the board frame Fig. 3-2 The PCB antenna is outside the board frame Scheme 2: The PCB antenna is placed along the board side and its lower part is hollowed Fig. 3-3 The PCB antenna is placed along the board side and its lower part is hollowed Scheme 3: The PCB antenna is placed along the board side and is not clad with copper Fig.
PAGE 10
4 Common Problems 4.1 Communication Failure of Module in Near Distance  Make sure the sending and receiving configuration is consistent, because inconsistent configuration will disenable normal communication.  Abnormal voltage: Too low voltage will lead to abnormal sending.  Low battery: when in low battery, the voltage will be reduced at the time of sending which will cause abnormal in sending.  Abnormal antenna soldering, RF signal failed to reach the antenna or wrong soldering of π circuit.
PAGE 11
Fig. 4-1 Back label 3.Display by the terminal device ： The SRRC ID, FCC ID, etc, can be referenced by the terminal device according to relevant standards. FCC Statement： This device complies with part 15 of the FCC rules Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
PAGE 12
5 Production Guide 5.1 Production Guide It is suggested processing SMT machine patch on the stamp tear sealing module, and finishing it within 24 hours after unpacking. Otherwise, please vacuumize and package again, so as to prevent the problem that the patch processing effect is poor due to damp. If there is a humidity indicator card in the package, it is suggested judging if the module needs to be baked according to the indication of the humidity card.
PAGE 13
5.4 Standard Operation Procedure (SOP) of Reflow Soldering Note: This Standard Operation Procedure (SOP) is only applicable to lead-free operation and for reference only. Fig.
PAGE 14
6 Packaging 6.1 Packaging Material Tape and Reel Foam Electrostatic Bag 6.2 Package Siz Fig.
PAGE 15
6.3 Packaging Direction Fig.