Specifications
Manuals
Brands
ZHEJIANG UNIVIEW TECHNOLOGIES Manuals
Electronics
WiFi Module
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Table Of Contents
1.Introduction
1.1Features
1.2Block Diagram
1.3General Specifications
2.Pin Assignments
2.1Pin Definition
3.Electrical and Thermal Specifications
3.1Recommended Operating Conditions
3.2Digital I/O DC Specifications
3.3Current Consumption
4.Interface Timing Specifications
4.1USB Bus during power on Sequence
5.WiFi & Bluetooth RF Specifications
5.12.4G WiFi RF Specification
5.25G WiFi RF Specification
5.3Bluetooth RF Specifications
6.Mechanical Specifications
6.1Module Outline Drawing
6.2Mechanical Dimensions
7.Application Information
7.1Typical Application Circuit
7.2Recommend PCB Layout Footprint
7.3Reflow Soldering Standard Conditions
8.Key Components Of Module
9.Package and Storage Information
9.1Package Dimensions
9.2Storage Conditions
空白页面
空白页面
1
4
7.2
Recommend
PC
B
Layout
Footprint
7.3
Reflow
So
ldering
S
tandard
C
onditions
Please
use
the
reflow
w
ithin
2
times.
Set
up
the
highest
temperature
within
250℃.
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