Product Data Sheet

Guangzhou ZHIYUAN Electronics Co., Ltd.
Wireless Communication Module
Product Datasheet ©2018 Guangzhou ZHIYUAN Electronics Co., Ltd.
8
AW5161P2 Datasheet
6. Production Guidance
6.1 Recommended production reflow temperature curve
The AW5161P2 series ZigBee module is recommended to follow the instructions in Figure
6- 1 and the solder manufacturer's guidelines during reflow soldering.
Figure 6- 1: Recommended production reflow temperature curve
6.2 Recommended production reflow temperature and time comparison
table
Figure 6- 1 lists detailed temperature and time comparison of AW5161P2 series ZigBee
module in the reflow soldering.
Table 6- 1: Recommended production reflow temperature and time comparison table
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)
100℃
150℃
Preheat Temperature max (Tsmax)
150℃
200℃
Preheat Time (Tsmin to Tsmax) (ts)
60-120 sec
60-120 sec
Average ramp-up rate (Tsmax to Tp)
3℃/second max
3℃/ second max
Liquidous Temperature (TL)
183℃
217℃
Time (tL) Maintained Above (TL)
60-90 sec
30-90 sec
Peak temperature (Tp)
220-235℃
230-245℃
Average ramp-down rate (Tp toTsmax)
6℃/ second max
6℃/ second max
Time 25℃ to peak temperature
6 minutes max
8 minutes max