ME3631 HARDWARE DEVELOPMENT GUIDE Version: V1.1 Date: 2017-02-23 LTE Module Series Website: www.ztewelink.com E-mail: ztewelink@zte.com.
ME3631 Hardware Development Guide LEGAL INFORMATION By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as ZTEWelink), you are deemed to have agreed to the following terms. If you don’t agree to the following terms, please stop using the document. Copyright © 2017 Shenzhen ZTEWelink Technology Co., Ltd. All rights reserved. The document contains ZTEWelink’s proprietary information.
ME3631 Hardware Development Guide ABOUT THIS DOCUMENT A. Application Range This document is the Product Technical Specification for the ME3631 GSM/WCDMA/LTE-FDD module. It defines the high level product features and illustrates the interface for these features. This document is intended to cover the hardware aspects of the product, including electrical and mechanical. B. Reading Note The symbols below are the reading notes you should pay attention on: : WARNING or ATTENTION C.
ME3631 Hardware Development Guide LDO Low-Dropout LED Light Emitting Diode LTE Long Term Evolution ME Mobile Equipment MO Mobile Origination Call MT Mobile Termination Call MSB Most Significant Bit PC Personal Computer PCB Printed Circuit Board PDA Personal Digital Assistant PDU Protocol Data Unit PAP Password Authentication Protocol PPP Point to Point Protocol RTC Real Time Clock SMS Short Messaging Service SMT Surface Mount Technology SPI Serial Peripheral Interface TBD
ME3631 Hardware Development Guide SAFETY INFORMATION The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating ME3610 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.
ME3631 Hardware Development Guide CONTENTS LEGAL INFORMATION ........................................................................................................................................................................... I REVISION HISTORY ........................................................................................................................................................................... I ABOUT THIS DOCUMENT..............................................................
ME3631 Hardware Development Guide 3. Antenna Interface ....................................................................................................................................................................... 37 3.1. Pin Definition ................................................................................................................................................................................. 37 3.2. Reference Design ............................................................
ME3631 Hardware Development Guide TABLES Table 1-1 ME3631 Supported Band ................................................................................................ 11 Table 1-2 ME3631 Key Features .................................................................................................. 11 Table 2-1 IO Parameters Definition .............................................................................................. 15 Table 2-2 Logic levels Description ......................................
ME3631 Hardware Development Guide Table 4-8 Conducted RF Receiving Sensitivity Typical Value [1] .................................................. 41 Table 4-9 Conducted RF Receiving Sensitivity Typical Value [2] .................................................. 41 Table 4-10 GNSS Technical Parameters...................................................................................... 42 Table 6-1 Testing Standard ..........................................................................................
ME3631 Hardware Development Guide FIGURES Figure 1–1 System Connection Structure ..................................................................................... 13 Figure 2–1 Pin Assignment .......................................................................................................... 15 Figure 2–2 Reference circuit of AAT2138 ..................................................................................... 22 Figure 2–3 Reference circuit of LDO ........................................
ME3631 Hardware Development Guide Figure 7–1 Module Board’s Steel Mesh Diagram ......................................................................... 50 Figure 7–2 Material Module Pallet ................................................................................................ 50 Figure 7–3 Tape Reel Dimension ................................................................................................. 51 Figure 7–4 Module Furnace Temperature Curve Reference Diagram ...........................
ME3631 Hardware Development Guide 1. P RODUCT OVERVIEW 1.1. G ENERAL D ESCRIPTION ME3631 is a WCDMA /LTE FDD wireless communication module with LCC interface. It is widely applied to but not limited to the various products and equipment such as laptops, vehicle-mounted terminals, and electric devices, by providing data services. Customer can choose the dedicated type based on the wireless network configuration and using area. The following table shows the entire radio band configuration of ME3631 series.
ME3631 Hardware Development Guide Support RTS and CTS hardware flow control Baud rate can reach up to 921600 bps,115200 bps by default Used for AT command, data transmission or firmware upgrade Debug UART interface: Two lines on debug UART interface, can be used for software debug, firmware upgrade USB Interface Compliant with USB 2.0 specification (slave only) Used for AT command communication, data transmission, software debug and firmware upgrade.
ME3631 Hardware Development Guide --Status interface (LED) Data Control Baseband Rx&Tx Control Rx GNSS Rx RF Transceiver Tx Duplexer Duplexer RF PA Rx 80PIN LCC Connector Interface FLASH & LPDDR2 USB USIM UART I2C SDIO SPI LED ADC GPIO MAIN_ANT DIV_ANT Figure 1–1 System Connection Structure 1.4.
ME3631 Hardware Development Guide 2. A PPLICATION INTERFACE 2.1. G ENERAL D ESCRIPTION ME3631 is equipped with an 80-pin 0.72mm pitch SMT pads plus 16-pin ground pads and reserved pads that connect to customer’s cellular application platform.
ME3631 Hardware Development Guide Figure 2–1 Pin Assignment NOTE: Keep all NC pins unconnected. 2.3. P IN D ESCRIPTION The following table shows the IO Parameters Definition.
ME3631 Hardware Development Guide PI Power input PO Power output AI Analog input AO Analog output OD Open drain The logic levels are described in the following table. Table 2-2 Logic levels Description Parameter Min Max Unit VIH 0.65*VDD_IO VDD_IO+0.3 V VIL -0.3 0.35* VDD_IO V VOH VDD_IO-0.45 VDD_IO V VOL 0 0.45 V NOTE: VDD_IO is the voltage level of pins. The following tables show the ME3631’s pin definition. Table 2-3 Pin Description Power Supply Pin Name Pin NO.
ME3631 Hardware Development Guide mode USB Interface Pin Name Pin NO. I/O Description DC Characteristics Comment USB_DP 24 IO USB differential data Compliant with USB Require differential impedance USB_DM 23 IO bus 2.0 standard specification of 90Ω USB_VBUS 22 PI USB power Pin Name Pin NO.
ME3631 Hardware Development Guide VOL max = 0.45V VOH min = 2.6V USIM_DETECT 41 DI USIM card input VIL min = -0.3V 1.8V power domain. Active low detection VIL max = 0.63V If no need of USIM detect, VIH min = 1.17V leave this pin not connected. VIH max = 2.1V ADC Interface Pin Name Pin NO. I/O Description DC Characteristics Comment ADC1 48 AI Analog to digital 0.05V to 4.15V External sensor signal detection ADC2 47 AI Analog to digital 0.05V to 4.
ME3631 Hardware Development Guide UART_DEBUG_RXD 67 DI Receive data VIL min = -0.3V 1.8V power domain VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V RF Interface Pin Name Pin NO. I/O Description DC Characteristics Comment MAIN_ANT 62 IO Main antenna 50Ω impedance DIV_ANT 79 AI Diversity antenna 50Ω impedance GNSS_ANT 10 IO GNSS antenna 50Ω impedance Pin Name Pin NO. I/O Description DC Characteristics Comment I2C_SCL 73 DO I2C serial clock VOL max = 0.45V Pull-up to 1.
ME3631 Hardware Development Guide VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V SDIO_D2 17 IO Secure digital IO data VOL max = 0.45V bit 2 VOH min = 1.35V 1.8V power domain VIL min = -0.3V VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V SDIO_D3 18 IO Secure digital IO data VOL max = 0.45V bit 3 VOH min = 1.35V 1.8V power domain VIL min = -0.3V VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V SDIO Interface Pin Name Pin NO.
ME3631 Hardware Development Guide wake up the external VOH min = 1.35V devices 7， 8， 12， 13， GPIO IO General input/output VOL max = 0.45V If unused, keep them floating. 27， 28， 29， 30， VOH min = 1.35V DO not pull-up PIN77 external 65， VIL min = -0.3V VIL max = 0.63V VIH min = 1.17V VIH max = 2.1V 66，64，75，76， NC No connection NC 77，45，44，43， 42，6，4 2.4. P OWER S UPPLY 2.4.1. POWER SUPPLY PINS The ME3631 is supplied through the V_BAT signal with the following characteristics.
ME3631 Hardware Development Guide Figure 2–2 Reference circuit of AAT2138 Option Two: LDO The over-current capability of LDO is above 2.5A. As the poor transient response of linear regulator, large capacitors should be placed at the input and output of LDO, place a capacitor above 220uF at output of LDO,R2、R3 recommend 1% accuracy. The reference power supply circuit design with LDO is shown as figure below: Figure 2–3 Reference circuit of LDO 2.5.
ME3631 Hardware Development Guide MCU Module pin1 POWER_ON GPIO from host R1 4.7K Power_on/off pulse R2 47K Figure 2–4 reference circuit to turn-on/off module(1) The following table shows the pin definition of POWER_ON/OFF. Table 2-5 POWER_ON/OFF Pin Description Pin Name Pin NO. I/O Description Comment POWER_ON 1 DI Turn on/off the module low active. Pull-up to 1.
ME3631 Hardware Development Guide 2.6. T URN OFF S CENARIOS The module supports two modes to turn off: Mode 1: Pull down pin1 (POWER_ON) for 2.5-3s will turn off the module. The power off process will take 22s at least. The reference circuit can refer to the figure 2-4. Parameter Description Min Typical Max Unit T2 The period that the POWER_ON signal for power off operation is 2.
ME3631 Hardware Development Guide NOTE: The resistors R1 and R2 in Figures below are only the recommended value and they need to adjust according to the actual situation. MCU Module pin2 RESET_N GPIO from host R1 1s 4.
ME3631 Hardware Development Guide USIM_RST 39 DO Reset signal of USIM card USIM_DETECT 41 DI USIM card hot swap detection pin. 1.8V power domain. The signal is internally pulled up. Keep USIM_DETECT not connected, if it is not used. When USIM detect function is enable (send AT command AT+ZSDT=1), and if it is Low, USIM is present; if it is High, USIM is absent. GND 36 Ground The following figure shows the reference design of the 8-pin USIM card.
ME3631 Hardware Development Guide NOTE: R14~R16 and D6 are applied to suppress the EMI spurious transmission and enhance the ESD protection.D6 should be closed to J4 The value of C33 shoule be less than 1uF. In order to enhance the reliability and availability of the USIM card in customer’s application, please follow the following criterion in the USIM circuit design: Keep layout of USIM card as close as possible to the module. Assure the possibility of the length of the trace is less than 50mm.
ME3631 Hardware Development Guide Figure 2–11 Molex 91228 USIM Card Holder Table 2-8 Pin Description of Molex USIM Card Holder Pin Name Pin NO. Function GND 1 Ground VPP 2 Not connected DATA I/O 3 USIM card data CLK 4 USIM card clock RST 5 USIM card reset VDD 6 USIM card power supply DETECT 7 USIM card Detection NC 8 Not defined, Connect to Ground For 6-pin USIM card holder, it is recommended to use Amphenol C707 10M006 512 2. Please visit http://www.amphenol.
ME3631 Hardware Development Guide Figure 2–12 Amphenol C707 10M006 512 2 USIM Card Holder Table 2-9 Pin Description of Amphenol USIM Card Holder Pin Name Pin NO. Function GND 1 Ground VPP 2 Not connected DATA I/O 3 USIM card data CLK 4 USIM card clock RST 5 USIM card reset VDD 6 USIM card power supply 2.9. USB I NTERFACE ME3631 contains one integrated USB transceiver which complies with the USB 2.0 specification and supports high speed (480 Mbps), full speed (12 Mbps) and low speed (1.
ME3631 Hardware Development Guide Table 2-10 USB Pin Description Pin Name Pin NO. I/O Description Comment USB_DP 24 IO USB differential data bus (positive) Require differential impedance of 90Ω USB_DM 23 IO USB differential data bus (negative) Require differential impedance of 90Ω USB_VBUS 22 PI USB power USB plug detect GND 21 Ground More details about the USB 2.0 specifications, please visit http://www.usb.org/home.
ME3631 Hardware Development Guide function mode while the Debug UART Port is used for software debugging or Firmware upgrade. The following show the different features. Main UART interface support 2400 4800 9600 19200 38400 57600 115200 460800 921600 1000000 1152000 1500000 2000000 2500000 3000000 3500000bps baud rate, the default is 115200bps, This interface can be used for data transmission; AT communication or firmware upgrade (upgrade is not supported currently).
ME3631 Hardware Development Guide Module TXB0108PWR MAX3238 DB9 to PC Figure 2–16 RS232 Level Match Circuit B. Reference Circuit of Main URAT Port to 4 Line UART Port The following figure shows the reference circuit of main UART interface with 4 line logic level translator. TXB0104PWR provided by Texas Instruments is recommended.
ME3631 Hardware Development Guide Table 2-13 Pin Definition of Network Indicator Pin Name Pin NO. I/O Description Comment LED_MODE 70 DO Indicate the module network registration mode 1.
ME3631 Hardware Development Guide ADC1 voltage range 0.05 4.15 V ADC2 voltage range 0.05 4.15 V 15 Bits ADC resolution 2.13. WAKEUP_IN S IGNAL The module provides an AP control interface for communicating with external Application Processor including WAKEUP_IN. The following table shows the pin definition of AP control interface. Table 2-17 Pin Definition of WAKEUP_IN Pin Name Pin NO. I/O Description Comment WAKEUP_IN 71 DI Input control signal 1.8V power domain. Pull-down internally.
ME3631 Hardware Development Guide 2.14. WAKEUP_OUT S IGNAL The module provides the WAKEUP_OUT pin which is used to wake up the external devices. Table 2-18 Pin Definition of WAKEUP_OUT Pin Name Pin NO. I/O Description Comment WAKEUP_OUT 71 DO Output wakeup signal 1.8V power domain The pin output a high-level voltage by default.
ME3631 Hardware Development Guide 2.15. GPIO I NTERFACE ( NOT SUPPORT YET ) Module provides 9 GPIO pins. The direction and output voltage level of the GPIO can be set by AT command “AT+ZGPIO”. The input voltage level of the GPIO can also be read by AT command “AT+ZGPIO”. For more details of these AT commands, please refer to document [AT Command Reference Guide of Module Product ME3631_V1.0]. Table 2-19 Pin Definition of GPIO Pin Name Pin NO.
ME3631 Hardware Development Guide 3. A NTENNA INTERFACE ME3631 antenna interface includes a main antenna, an Rx-diversity antenna and a GNSS antenna to improve receiving performance. The antenna interface has an impedance of 50Ω. 3.1. P IN D EFINITION The main antenna and Rx-diversity antenna pins definition are shown below. Table 3-1 Pin Definition of GPIO Pin Name Pin NO.
ME3631 Hardware Development Guide VDD L3 R1 C1 C3 C2 GNSS_ANT MODULE L1 L2 Figure 3–2 Reference Circuit of GNSS Antenna NOTE: Keep a proper distance between main and diversity antenna to improve the receiving sensitivity. GNSS and Rx-diversity are not supported by C1B; therefore GNNS antenna design is not concerned in C1B type. 3.3.
ME3631 Hardware Development Guide the mainboard by several points to shield electromagnetic interference. Besides, data cables of the LCD and the camera might introduce interference signals, which affect the receiving performance of the antenna. Thus, it is necessary to wrap conductive cloth around the two data cables and connected them to the ground.
ME3631 Hardware Development Guide 4. E LECTRICAL , R ELIABILITY AND R ADIO CHARACTERISTICS 4.1. A BSOLUTE M AXIMUM R ATINGS Absolute maximum ratings for power supply and voltage on digital and analog pins of module are listed in the following table: Table 4-1 Absolute Maximum Ratings Parameter Min Max Unit V_BAT 3.4 4.2 V Peak current of V_BAT 0 2 A Voltage at digital pin -0.3 2.1 V Voltage at ADC1 0.05 4.15 V Voltage at ADC2 0.05 4.15 V 4.2.
ME3631 Hardware Development Guide Bandwidth LTE 5MHz 10MHz 15MHz 20MHz LTE FDD Band 2, Pout=23dBm 575 575 620 630 mA LTE FDD Band 4, Pout=23dBm 515 530 550 600 mA LTE FDD Band 5 ,Pout=23dBm 610 610 mA LTE FDD Band 12,Pout=23dBm 620 630 mA LTE FDD Band 17, Pout=23dBm 550 600 mA Table 4-6 Averaged standby DC power consumption [3] Parameter Condition Typical Value Unit WCDMA Band2, Pout=24dBm 532 mA Band5, Pout=24dBm 526 mA GSM850， Pout=33dBm 280 mA PCS1900， Pout=29dB
ME3631 Hardware Development Guide 4.5. GPS/GNSS T ECHNICAL P ARAMETERS The following table shows the GNSS(GPS/GLONASS) techinical parameters of ME3631 module. Table 4-10 GNSS Technical Parameters GPS/GNSS (GNSS/GLONASS) Technical specification GPS/GNSS Frequency 1575.42±1.023 MHz Tracking sensitivity -156dbm Cold-start sensitivity -144dbm TTFF (Open Sky) Hot start: 4s Cold start: 32s Receiver Type Qualcomm GNSS Gen8C GNSS L1 Frequency 1575.
ME3631 Hardware Development Guide Figure 5–2 ME3631 Bottom Dimensions (Bottom view) All Rights reserved, No Spreading abroad without Permission 43
ME3631 Hardware Development Guide 5.2. F OOTPRINT OF R ECOMMENDATION Figure 5–3 Recommended Footprint (Top view) NOTE: Keep out the area below the test point (circular area on the above figure) in the host PCB. In order to maintain the module, keep about 3mm between the module and other components in the host PCB. 5.3.
ME3631 Hardware Development Guide Figure 5–4 Top&Bottom View of the ME3631(just for reference) All Rights reserved, No Spreading abroad without Permission 45
ME3631 Hardware Development Guide 6. R ELATED T EST & T EST S TANDARD 6.1. T ESTING R EFERENCE The related tests of MODULE comply with the IEC standard, including the equipment running under high/low temperature, storage under high/low temperature, temperature shock and EMC. Table 6-1 is the list of testing standard, which includes the related testing standards for MODULE.
ME3631 Hardware Development Guide 6.2. D ESCRIPTION OF T ESTING E NVIRONMENT The working temperature range of MODULE is divided into the normal working temperature range and the extreme working temperature range. Under the normal working temperature range, the testing result of RF complies with the requirements of 3GPP specifications, and its function is normal.
ME3631 Hardware Development Guide 6.3. R ELIABILITY T ESTING E NVIRONMENT The reliability test includes the vibration test, high/low-temperature running, high/low-temperature storage and temperature shock experiment test. Refer to Table 6-4 for the specific parameters. Table 6-4 Reliability Features Test Item Test Condition Test Standard Random vibration Frequency range: 5-20Hz, PSD: 1.
ME3631 Hardware Development Guide 7. SMT P ROCESS AND BAKING G UIDE This chapter describes module’s storage, PAD design, SMT process parameters, baking requirements, etc., and it is applicable for the process guide to second-level assembly of LCC encapsulation module. 7.1. S TORAGE R EQUIREMENTS Storage conditions: temperature<40℃, relative humidity<90% (RH), 12 months weld ability guaranteed under this circumstances of excellent sealing package.
ME3631 Hardware Development Guide Steel mesh opening Module PAD GAP (G)=Center Distance (e)－PAD width (X) G≥0.5mm Drill holes at 100% scale in the direction of width; extend 0.3mm outward in the direction of length Contract 0.05~0.1mm in the G＜0.5mm direction of width; Contract 0.05~0.1mm inward in the direction of length, extend 0.5mm outward in the direction of length. 0.1mm 0.1mm 0.5mm Steel mesh opening Module PAD on PCB 0.1mm Figure 7–1 Module Board’s Steel Mesh Diagram 7.3.3.
ME3631 Hardware Development Guide 2） Tape Reel Dimension (unit: mm): The following picuture is the tape reel specific dimension for your reference: A: Whole dimension: B: Detailed dimension: Figure 7–3 Tape Reel Dimension 3） Mounting Pressure: In order to ensure a good contact between the module and the solder paste on main board, the pressure of placing the module board on main board should be 2-5N according to our experiences.
ME3631 Hardware Development Guide 150～200℃: 60～～120S Temperature rise slope: <3℃/S Temperature drop rate: －2～－4℃/S NOTE: The test board of furnace temperature must be the main board with the module board mounted on, and there must be testing points at the position of module board. Figure 7–4 Module Furnace Temperature Curve Reference Diagram 7.3.5. REFLOW METHOD If the main board used by customers is a double-sided board, it is recommended to mount the module board at the second time.
ME3631 Hardware Development Guide environment. Refer to the following environment requirements: WARNING: The product’s transportation, storage and processing must conform to IPC/JEDEC J-STD-033. 7.4.2. BAKING DEVICE AND OPERATION PROCEDURE Baking device: Any oven where the temperature can rise up to 125°C or above.
ME3631 Hardware Development Guide As long as 2 conditions above are met, further transmitter test will not be required.
