ZTE MG2639 Module Hardware Design User Manual Version：V1.
User Manual Copyright Statement If you accept this manual of ZTE Corporation, it means that you have agreed to the following terms and conditions; if you don’t agree, please stop using this manual. The copyright of this manual belongs to ZTE Corporation. ZTE Corporation reserves any rights not expressly granted in this manual. The contents in this manual are the proprietary information of ZTE Corporation.
User Manual Version update description Product version Document version ZTE MG2639 Document No. V1.0 ZTE MG2639 Document update descriptions Released for the first time 1) the module’s thickness has changed from 2.68mm to 3.0mm. V1.2 Date of release 2013-9-6 2014-1-4 Writer Document version Date Written by 1.0 2012-8-23 Cai Zongfei 1.1 2013-11-08 Cai Zongfei 1.
User Manual 3. Provide evaluations and technical diagnosis for principle diagram, PCB, test scenarios; 4. Provide test environment; ZTE Corporation provides customers with onsite supports, and also you could get supports through telephone, website, instant messenger, E-mail, etc.
User Manual Summary Preface This document describes ZTE MG2639 module’s product principle diagram, module’s PINs, hardware interface and module’s structure, and instructs the users to perform hardware design of modules, and quickly and conveniently design different kinds of wireless terminals on the basis of this module.
User Manual Contents 1 2 3 GENERAL DESCRIPTION OF MODULE............................................................................... 1 1.1 INTRODUCTION OF MODULE’S FUNCTIONS 1 1.2 MODULE’S APPLICATION BLOCK DIAGRAM 2 1.3 ABBREVIATIONS 3 DESCRIPTIONS OF MODULE’S EXTERNAL INTERFACES .................................................. 6 2.1 DEFINITIONS OF MODULE’S INTERFACES 6 2.2 ANTENNA INTERFACE 2.3 ANTENNA INTERFACE’S RF PERFORMANCE 2.
User Manual 4.2 UART INTERFACE 20 4.2.1 DESCRIPTIONS OF UART1 INTERFACE 22 4.2.2 DESCRIPTIONS OF UART2 INTERFACE 23 5 4.3 SIM CARD INTERFACE 23 4.4 AUDIO INTERFACE 24 1.1 CHARGING INTERFACE PCB DESIGN ................................................................................................................... 27 5.1 6 26 PCB DESIGN 27 MODULE BOARD’S MOUNTING PROCESS AND BAKING GUIDE ........................... 28 6.1 MODULE’S MOUNTING PROCESS 28 6.1.1 PROCESS ROUTING SELECTION 28 6.
User Manual Figures Figure 1-1 Module’s application block diagram ................................................................................... 3 Figure 2-1 π shape matching network diagram ................................................................................... 9 Figure 2-2 Antenna interface diagram ............................................................................................... 10 Figure 2-3 RF test socket dimensions ........................................................
User Manual Table 3-12 SIM card interface signal definitions ................................................................................ 15 Table 3-13 Audio interface signal definitions .................................................................................... 16 Table 3-14 ZTE MG2639 (GPRS) power consumption ....................................................................... 16 Table 3-15 ZTE MG2639 module’s temperature characteristics ...................................................
User Manual 1 General description of module Developed by ZTE Corporation, ZTE MG2639 is a kind of GSM850/EGSM900/DCS1800/ PCS1900 industrial module, which can be built in the Set-Top-Box, vehicle-mounted terminals through a 60-PIN stamp-hole interface, and it allows users to send/receive Emails, browse the web pages and download at high speed anywhere and anytime. In a place where the GSM network is covered, users can get access to the Internet any time, send/receive SMS and dial/answer voice calls, etc.
User Manual Parameters ZTE MG2639 Antenna SMT 50Ω antenna connector Integrated Full Duplex UART AT commands/Data transmission SIM card socket level 1.8V/3.0V Data service GPRS Class 12 Mobile Station Class B Max Downlink 85.6kbps Max Uplink 42.8kbps Protocol Internal TCP/IP & UDP protocol stack Embedded FTP SMS Support TEXT/PDU Mode Point-to-point MO/MT SMS Cell Broadcast Voice call Audio encoder HR/FR/EFR/AMR// Echo Cancellation/Volume Control/DTMF AT Command Set GSM 07.05/GSM 07.
User Manual Figure 1-1 Module’s application block diagram 1.
User Manual CPU D DAI DAC DCE DSP DTE DTMF DTR E EDGE EFR EGSM EMC EMI ESD ETS F FDMA FR G GPRS GSM Central Processing Unit GPS H HR I IC IMEI ISO ITU L LCD LED M MCU MMI MS MTBF P PCB PCL PCS PDU PLL PPP R RAM RF ROM Global Positioning System Digital Audio interface Digital-to-Analog Converter Data Communication Equipment Digital Signal Processor Data Terminal Equipment Dual Tone Multi-Frequency Data Terminal Ready Enhanced Data Rate for GSM Evolution Enhanced Full Rate Enhanced GSM Electromagnetic Co
User Manual RMS RTC S SIM SMS SMT SRAM T TA TDMA TE U UART UIM USB USIM V VSWR Z ZTE Root Mean Square Real Time Clock Subscriber Identification Module Short Message Service Surface Mount Technology Static Random Access Memory Terminal adapter Time Division Multiple Access Terminal Equipment also referred it as DTE Universal asynchronous receiver-transmitter User Identifier Management Universal Serial Bus Universal Subscriber Identity Module Voltage Standing Wave Ratio ZTE Corporation This document is not
User Manual 2 Descriptions of module’s external interf aces ZTE MG2639 module connects externally through a 60PIN stamp-hole interface. 2.1 Definitions of module’s interf aces See the definitions of ZTE MG2639 module’s 60PIN stamp-hole interface in the following table: Table 2-1 60pin stamp-hole definitions PIN No.
User Manual 16 17 18 19 20 21 22 NC GND NC NC NC NC NC NC Ground NC NC NC NC NC Charging control Charging control Power Charging control Charging control Analogue signal input 23 BATSNS 24 ISENSE 25 VCHG 26 CHR_LDO 27 GATDRV 28 ADCIN 29 URXD1/SPIM OSI UART1/SPI Input, GPIO20 30 UTXD1/SPIMI SO UART1/SPI Output， GPIO21 31 SYSRST_N 32 EAR_L 33 RECP 34 RECN 35 MIC_P1 36 MIC_P0 37 MIC_N0 Reset Analogue audio Analogue audio Analogue audio Analogue audio Analogue audio Analogu
User Manual Input, GPIO22 Output, GPIO23 I/O I/O Output， GPIO38 Output， GPIO40 Output， GPIO46 Output， GPIO37 Input， GPIO39 Output， GPIO36 43 URXD2 UART2 44 UTXD2 UART2 45 46 USB_DM USB_DP USB USB 47 LSDA0 Serial LCD 48 LSCE0B0 Serial LCD 49 LSRSTB Serial LCD 50 LSCK0 Serial LCD 51 LSDI0 Serial LCD 52 LSA0DA0 Serial LCD 53 SDA28/SPICS I2C/SPI I/O，GPIO2 54 SCL28/SPISC K I2C/SPI Output， GPIO1 55 PWM/EARDE T PWM output Output， GPIO0 56 PCMRST PCM reset 57 PCMOUT PCM
User Manual According to the standard for mobile devices, the stationary wave ratio of ZTE MG2639 module’s antenna should be between 1.1 and 1.5, and input impedance is 50 ohm. Different environments may have different requirements on the antenna’s gain. Generally, the larger gain in the band and smaller outside the band, the better performance the antenna has. Isolation degree among ports must more than 30dB when multi-ports antenna is used.
User Manual Scenario 2: When using GSM RF socket as the antenna feed, disconnect PIN2 from the main board and make sure there are some empty areas below or around PIN2. Keep 2mm distance between the surface of PIN2 and GND, and drill holes below PIN2. It’s not suggested to use the compatible design of PIN2 at the same time when using the RF connector.
User Manual 2.3 Antenna interf ace’s RF perf ormance See the antenna interface’s RF performance in table 2-2: Table 2-2 Antenna interface’s RF performance Antenna interface’s RF performance GSM850 EGSM900 DCS1800 PCS1900 Module’s uplink （MS->BTS） Module’s downlink （BTS->MS） 824MHz-849MHz 880MHz-915MHz 1710MHz-1785MHz 1850MHz-1910MHz 869MHz-894MHz 925MHz-960MHz 1805MHz-1880MHz 1930MHz-1990MHz Max. Tx. Power （dBm） 33±2 33±2 29±2 29±2 Antenna interface’s Rx.
User Manual 3 Module’s electrical characteristics The chapter mainly describes the module’s electrical characteristics, including the level, power consumption, reliability of module’s interfaces. 3.1 Descriptions of levels of interface signals It describes the MAX, MIN and typical value of the level of module’s external interfaces. 3.1.1 Reset The reset PIN is pulled up to 2.8V（Vmax=2.9V，Vmin=2.7V，Typical=2.8V）through the resistance inside the module.
User Manual I2C 53 SDA I/O 54 SCL Output I2C data cable I2C clock cable 2.8V IO 2.8V IO Note: the software doesn’t support this interface by default, therefore it requires customization. 3.1.4 SPI ZTE MG2639 module provides one SPI BUS interface, SPICS & SPISCK signal multiplex with the I2C interface, while SPIMOSI & SPIMISO signals multiplex with the UART interface. When UART2 and I2C function are not used, it can be configured as the SPI interface.
User Manual 3.1.6 USB ZTE MG2639 module integrates the USB interface and conforms to USB1.1 interface specifications. The module can connect the host through the interface and provide up to 12Mbps data rate. Users can upgrade the software via the interface. Table 3-5 USB interface signal definitions Classification USB No. 45 46 Definitions USB_DM USB_DP I/O I/O I/O Description USB data USB data + Remarks 3.1.7 ADC MG2639 module’s 28th pin can provide up to 98.
User Manual Classification LCD No. Definitions I/O 47 LSDA0 Output 48 49 50 LSCE0B0 LSRSTB LSCK0 Output Output Output 51 LSDI0 Output 52 LSA0DA0 Output Description Serial LCD data cable data0 Serial LCD enabled Serial LCD reset Serial LCD clock cable Serial LCD data cable input Serial LCD data cable data1 Remarks Note: the software doesn’t support this interface by default, therefore it requires customization. 3.1.
User Manual 14 11 12 13 SIM VSIM SIM_RST SIM_CLK SIM_DATA Output Output Output I/O SIM card voltage SIM card reset SIM card clock SIM card data 1.8V/3V, Max. output current 30 mA 3.1.12 Audio interface ZTE MG2639 module supports 2CH audio signal inputs/outputs. The two MIC inputs are internally capacitive coupled with the offset voltage, and directly connected to the receiver. See the audio interface signals in the table 3-2: Table 3-13 Audio interface signal definitions Classification AUDIO 3.1.
User Manual 180 mA 175 mA GSM1800 GSM1900 Network searching 3.3 78mA Reliability characteristics The module’s reliability testing items include: High/low temperature operation, high/low temperature storage, thermal shock, alternating temperature humidity, etc. The test results must conform to the industrial requirements. See the module’s working temperature in the table below: Table 3-15 ZTE MG2639 module’s temperature characteristics Parameters Descriptions Min. Max.
User Manual 4 Interface circuit design The chapter provides the reference design on the interface circuit according to the module’s functions and describes the precautions. 4.1 Reset and power design See the reference design principle of power and reset circuit in figure 4-1. Select appropriate parameters according to the actual selected power supply since VD1 is TVS tube, and select CJ2305 from Changjiang Electronics or DMP2305U-7 from DIODES since VT1 is MOS tube.
User Manual Figure 4-2 Power reference circuit 输入电压 输出模块用电压VBAT IN OUT /SHUT R4 10K TAB GND C5 10uF C6 0.1uF SENSE D1 MIC29302 R5 2.2K C7 0.1uF R6 1K C8 100uF Power design ZTE MG2639 module is powered by VBAT. If the external power cannot be stably started, it’s recommended to add buffer circuit in the circuit. See the module’s required voltage characteristics in table 4-1. Table 4-1 Voltage characteristics Classification Vmin Typical Vmax Input voltage 3.4V 3.8V 4.
User Manual See the module’s power-on/off time sequence in figure 4-3 below: Figure 4-3 Power-on/off time sequence VDDIO The module has one LDO voltage output pin, which can be used to supply external power to the main board. The voltage output is available only when the module is on. The normal output voltage is 2.8V, and users should absorb the current from this pin as little as possible (less than 10mA).
User Manual ZTE MG2639 module’s output I/O level is 2.8V, therefore it needs level conversion when connecting with standard 3.3V or 5V logic circuit（such as MCU or RS232 drive chip MAX3238）. The most common method is to use a dynatron to realize the level conversion. Figure 4-3 shows the level conversion to 3.3V through the UART interface of ZTE MG2639. The resistance and capacitance in figure 4-3 are just for reference, and they need to be recalculated during the design.
User Manual 4.2.1 Descriptions of UART1 interface Figure 4-5 UART1 DCE－DTE connection relationship diagram See the definitions of UART1 interface in table 4-3. Table 4-3 UART1 interface definitions Classification UART No.
User Manual 4.2.2 Descriptions of UART2 interface Figure 4-6 UART2 DCE－DTE connection relationship diagram See the definitions of UART2 interface in table 4-4. Table 4-4 UART2 interface definitions Classification UART 4.3 No. Definitions I/O Descriptions Remarks 43 RXD2 Input Receiving data DTE transmits serial data 44 TXD2 Output Transmitting data DTE receives serial data SIM card interface ZTE MG2639 module supports 1.8V or 3.0V SIM card. Refer to figure 4-7 for design.
User Manual Figure 4-7 SIM card circuit reference design diagram NOTE: (1) The SIM card PCB wiring should be laid closely around the module as much as possible. (2) The VSIM, CLK, DATA and RST signals should be enveloped by the ground wires. The position of 33pF capacitance should be reserved on CLK, DATA and RST signals wiring and the position should be close to the SIM card socket to prevent the interference sources from affecting the SIM card’s reading/writing.
User Manual Figure 4-8 Audio interface circuit reference design principle diagram Microphone The MIC_N0 & MIC_P0 are both differential interfaces, and they can also be used for single-ended input. It’s recommended to use differential method to reduce the noises. The MIC2_P interface is used for single-ended input. Directly connect to the microphone since these two inputs are internally coupled and 1.9V offset voltage is generated.
User Manual Select the microphone with the sensitivity lower than -51.5dB since the max. gain in MIC1 can reach 51.5dB. The level of MIC_P1 is about 1.73V. Note: In order to get better audio effect for users, we present the following suggestions: 1）During the process of using ZTE MG2639 module, it’s advised to use 100pf & 33pf capacitance on its external audio path, and serially connect with the beads to improve the audio quality.
User Manual 5 PCB design 5.1 PCB design 1）Enough Pad area must be reserved for the module’s grounding pin to guarantee adequate grounding and avoid interference on the sensitivity. 2）Copper-clad and wiring are forbidden in the nearby areas of the RF stamp-hole. 3）For the convenience of testing and maintenance, it is recommended to drill holes on the PCB to expose JTAG test points.
User Manual 6 Module Board’s Mounting Process and Baking Guide 6.1 Module’s mounting process Now with the increasing number of module board products in our company, customers have encountered numerous welding problems of module boards during the process of using the products. Therefore, we specially formulate the guide to the module board’s mounting process for customers in order to ensure the FTT of soldering at the client-end. The current standard of flatness in our company is 0.
User Manual Thicknesses of White Oil and Green Oil (The diagram is just for your reference; it does not represent the actual module encapsulation) In addition, other components cannot be arranged within 2mm around the module on the interface board to ensure the maintenance of the module. 6.1.
User Manual 6.1.5 Module Board’s Mounting The pallets, which are suitable for mounting, have been made for many modules. If our company has offered the pallets, customers can directly apply them in Pick & placement machine; otherwise, customers need make a loading tool similar to the pallet. Customers can take out the modules from the packaging box, put them into the pallet according to the sequence and direction, and then start mounting.
User Manual The furnace temperature test board must be a physical board mounted on the interface board, and there must be the testing wires at the module board. 6.1.7 Reflow Method If the interface board used by customers is a double-sided board, it is recommended to mount the module board at the second time. In addition, it is preferable for the interface board to reflow on the mesh belt at the first mounting and the second mounting.
User Manual 6.2.1 Module’s Baking Environment The operators must wear dust-free finger cots and anti-static wrist strap under the lead-free and good static-resistant environment. See the following environment requirements. During the process of transportation, storage and disposal, you must conform to the IPC/JEDE J-STD-033 standard. 6.2.2 Baking Devices and Operation Procedure Baking device: any oven where the temperature can rise up to 125°C or above.
User Manual 7 7.1 Mechanical dimensions Appearance diagram Figure 7-1 ZTE MG2639 appearance diagram Dimensions (L×W×H)：30.0 × 25.0 × 3.
User Manual 7.2 Module’s assembly diagram See the module’s assembly diagram in figure 7-2.
User Manual 7.3 Module’s PCB package dimensions See the module’s PCB package dimensions in figure 7-3.
User Manual Figure 7-4 Relevant package dimensions from BOTTOM view This document is not allowed to transmit without ZTE Corporation’s permission ©ZTE CORPORATION All rights reserved 36
User Manual 8 Declaration of Conformity We ZTE CORPORATION ZTE Plaza, Keji Road South, Hi-Tech Industrial Park, Nanshan District, Shenzhen, P.R. China Declare under our sole responsibility that the product ZTE MG2639 To which this declaration relates, is inconformity with the following standards EN 301 511 V9.0.2; EN 301 489-1 V1.9.2; EN 301 489-7 V1.3.
User Manual 9 Important announcement FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. IMPORTANT NOTE This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module.
