MG2639 User Manual Version：V1.
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Descriptions of version update Product version Document version MG2639 V1.0 Document No. Descriptions of document update Release for the first time Author Document version Date Written by 1.0 2011-8-22 Zhou Tao 第 II 页 ©ZTE CORPORATION All rights reserved Checked by Approved by This document is not allowed to transmit without ZTE Corporation’s permission.
With strong technical force, ZTE Corporation can provide CDMA/GPRS/WCDMA module customers with the following all-around technical support: 1. Provide complete technical documentation; 2. Provide the development board used for R&D, test, production, after-sales, etc.; 3. Provide evaluations and technical diagnosis for principle diagram, PCB, test scenarios; 4.
Preface Summary This document introduces MG2639 module’s product principle diagram, PINs, hardware interface and module’s mechanical design, which can instruct the users how to quickly and conveniently design different kinds of wireless terminals based on this type of module.
Contents 1 2 3 GENERAL DESCRIPTION OF MODULE ........................................................................ 1 1.1 INTRODUCTION OF MODULE’S FUNCTIONS ..................................................... 1 1.2 MODULE’S PRINCIPLE DIAGRAM ....................................................................... 2 1.3 ABBREVIATIONS ................................................................................................... 3 DESCRIPTIONS OF MODULE’S EXTERNAL INTERFACES ..................
6.4 ANTENNA SUBSYSTEM ..................................................................................... 18 6.4.1 ANTENNA SPECIFICATIONS .................................................................... 18 6.4.2 CABLE LOSS.............................................................................................. 19 6.4.3 ANTENNA GAIN MAXIMUM REQUIREMENTS ......................................... 19 6.4.4 ANTENNA MATCHING .............................................................................
Figures Figure 1-1 Module’s principle diagram ............................................................................................ 2 Figure 2-1 Antenna interface diagram............................................................................................. 6 Figure 5-1 MG2639 module’s appearance.................................................................................... 15 Figure 5-2 Module’s assembly diagram .............................................................................
1 General description of module This chapter mainly provides a general description of the module, including basic functions and logic block diagram. 1.1 Introduction of module’s functions The maximum operating ambient temperature of the equipment declared by the manufacturer is 75℃ Table 1-1 Module’s functions Parameter MG2639 General Features Frequency Bands GSM850/EGSM900/DCS1800/PCS1900 Dimensions 30.0×25.0x2.
Parameter MG2639 Support TEXT/PDU Mode Point-to-point MO/MT SMS Cell Broadcast Voice Features Vocoders HR/FR/EFR/AMR Echo Cancellation/Volume Control/DTMF AT Command Set GSM 07.05/GSM 07.07/ZTE Proprietary AT Commands 1.2 Module’s principle diagram The block diagram is used to describe the module’s major logic functions: Figure 1-1 Module’s principle diagram 第2页 ©ZTE CORPORATION All rights reserved This document is not allowed to transmit without ZTE Corporation’s permission.
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LCD LED M MCU MMI MS MTBF P PCB PCL PCS PDU PLL PPP R RAM RF ROM RMS RTC S SIM SMS SMT SRAM T TA TDMA TE U UART UIM USB USIM V VSWR Z ZTE 第4页 Liquid Crystal Display Light Emitting Diode Machine Control Unit Man Machine Interface Mobile Station Mean Time Before Failure Printed Circuit Board Power Control Level Personal Communication System Protocol Data Unit Phase Locked Loop Point-to-point protocol Random Access Memory Radio Frequency Read-only Memory Root Mean Square Real Time Clock Subscriber Identifica
2 Descriptions of module’s external interfaces This chapter mainly describes the module’s external interfaces, such as B2B connector, MINI PCI-E, stamp-hole connector, etc. 2.1 Definitions of module’s interfaces No. 1 2 3 Definition GND RF_ANT GND 4 RING 5 6 GND VBAT 7 RSSI_LED 8 RTS Table 1-1 28Pin stamp-hole definition I/O Description Remarks GND I/O RF antenna GND Ring signal Level varies upon an incoming call or O indication receipt of text message.
9 10 11 12 13 14 15 16 CTS DCD CARD_RST CARD_CLK CARD_DATA V_CARD RXD TXD O O O O I/O O I O Clear to send Carrier detection card reset card clock card data Card voltage Receive data Transmit data 17 SYSRST_N I Reset signal 18 SPK_2P O 19 SPK_1P O 20 SPK_1N O 21 MIC_2P I 22 MIC_1P I 23 MIC_1N I Headset Speaker + Microphone speaker + Microphone speaker Headset microphone + Receiver microphone + Receiver microphone - 24 PWRKEY_N I 25 DTR I 26 27 28 DSR V_MSM GND O O power on
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3 Module’s electrical characteristics This chapter mainly introduces the module’s electrical characteristics, including the level, power consumption, reliability of module’s interfaces. 3.1 Descriptions of levels of interface signals It describes the MAX, MIN and typical value of the level of module’s external interfaces. 3.1.1 Reset SYSRST_N PIN is used to reset the module’s main chip, and SYSRST_N signal needs to be pulled down 500ms to reset the module. Likewise, this pin is required to pull up 2.
Classification SIM 3.1.3 Definition V_CARD CARD_RST GND CARD_CLK CARD_DATA I/O O O O I/O Description Card voltage Card reset GND Card clock Card data Remarks 1.8V/3V; maximum output current 20mA Audio Interface MG2639 module supports 2CH audio signal inputs/outputs. It features in handheld microphone, handheld receiver or hands-free speaker and earpiece microphone/receiver function.
SIG_LED PIN output status is defined according to the software protocol, and users could judge the module’s work status according to SIG_LED status. SIG_LED PIN is common I/O port, which can’t directly drive LED, and it needs to work with dynatron. 3.2 Module Power Consumption It describes the module’s power consumption under each status: No.
4 Interface circuit design It provides the reference design circuit of the interface and precautions according to the module’s functions. 4.1 Reset and power design See the reference design principle of power and reset circuit in figure 4-1: Figure 4-1 Power and reset circuit reference design principle diagram Power design MG2639 module is powered by VBAT. See the voltage characteristics in table 4-1. Table 4-1 Voltage characteristics Classification MIN Typical MAX Input voltage 3.4V 3.9V 4.
Power off To turn off the module, use AT command “AT+ZPWROFF” or provide a 2s~5s low level pulse to PWRKEY_N PIN. Reset Use the above method to firstly “power-off” and then “power-on” to hard reset the module. If the external reset function has to be used, low level pulse lasting at least 500ms should be provided to /RESET Pin within 2 seconds after the module is turned on. Before that, the external I/O signal must be kept at low level. See the reset circuit design in figure 4-1.
directly. Common low power switch triode should be applied as the crystal triode shown in Figure 4-3. Please note that the module won’t enter sleep mode as RXD is at high level. Figure 4-3 UART interface reference design block diagram Remarks: the module doesn’t support USB. 4.3 SIM card interface MG2639 module supports 1.8V or 3V SIM card, and there are 4 pins at the terminal of the card. V_CARD is used to supply SIM card. It’s strongly recommended to add ESD to protect SIM card in hostile environments.
NOTE: The SIM card PCB wiring should be laid closely around the module as much as possible to prevent the interference sources from affecting the SIM card’s reading/writing. Besides, Since the SIM card needs to be designed to meet the requirements of ESD performance and avoid the damage of the SIM card caused by ESD, it’s recommended to add TVS components on 4-CH SIM card signals, meanwhile, the signal wires need go through TVS component before entering the module’s baseband processor during the layout. 4.
5 Mechanical dimensions It introduces the module’s mechanical dimensions. 5.1 Appearance Diagram Figure 5-1 MG2639 module’s appearance Dimensions（L×W×H）：30.0×25.0×2.68mm Weight：7g 5.2 Module Assembly Diagram See the module assembly diagram in figure 5.2. Figure 5-2 Module’s assembly diagram This document is not allowed to transmit without ZTE Corporation’s permission.
5.3 PCB Dimensions See the module’s PCB dimensions in figure 5-3. Figure 5-3 Relevant PCB dimensions Precautions while designing PCB: 1）Copper-clad and wiring are forbidden at the area below the RF test points. 2）For the convenience of testing and maintenance, it might be necessary to drill holes on the PCB. 6 Antenna Interface The RF interface of the MG2639 Module has an impedance of 50 .
Regarding the return loss, the Module provides the following values in the active band: Table 6-1 Return Loss in the Active Band Return Loss of Recommended Return Loss of State of Module Module Application Receive Transmit ≥ 8dB not applicable ≥ 12dB ≥ 12dB The connection of the antenna or other equipment must be de coupled from DC voltage. This is necessary because the antenna connector is DC coupled to ground via an inductor for ESD protection. 6.
Table 6-2 Product specifications of MM9329-2700B connector Part Number Rated Volta g e (V) MM932 9 -2700B 250 Contact Resista n ce (ohm) 0.015 max. Withstand i ng Voltage (rms) Insulati o n Resistan ce (M ohm) Durabil i ty (cycles) Freque n cy Rating (GHz) Temperat u re Range (degree C) 300 (AC) 500 min. 100 DC - 6.0 -40~+90. VSWR Cente r Conta ct Outer Conta ct Insulato r 1.2 max. (DC~3G H z) Coppe r Alloy Gold plated Coppe r Alloy Silver plated Engineer i ng plastic 6.
6.4.2 Cable Loss All cables have RF losses. Minimizing the length of the cable between the antenna and the RF connectors on the module will help obtain superior performance. High Quality/Low loss co-axial cables should be used to connect the antenna to the RF connectors. Contact the antenna vendor for the specific type of cable that interfaces with their antenna and ask them to detail the RF losses of the cables supplied along with the antenna.
two different polarized ports on dual-polarized antenna, two different frequency ports on dual-frequency antenna, or among four ports on dual-polarized dual-frequency antenna, isolation degree should be more than 30dB. 7 OEM/Integrators Installations Clear and specific instructions describing the conditions, limitations and procedures for third-parties to use integrate the module into a host device.
8. EU Regulatory Conformance Hereby, ZTE CORPORATION declares that this device is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. For the declaration of conformity, visit the Web site www.zte.com This document is not allowed to transmit without ZTE Corporation’s permission.
