Hardware Development Guide of Module Product MW3650 Version V1.
MW3650 0 Hardware Development Guide of Module Products Legal Information By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as ZTEWelink), you are deemed to have agreed to the following terms. If you don’t agree to the following terms, please stop using the document. Copyright © 2015 Shenzhen ZTEWelink Technology Co., Ltd. All rights reserved. The document contains ZTEWelink’s proprietary information.
MW3650 0 Hardware Development Guide of Module Products Revision History Version 1.
MW3650 0 Hardware Development Guide of Module Products Contents Figures ................................................................................................................................................. VII Tables ................................................................................................................................................. VIII 1 2 3 4 About This Document ..................................................................................................
MW3650 0 Hardware Development Guide of Module Products 5 6 7 4.5.2 Power Off .............................................................................................................. 31 4.5.3 Reset ...................................................................................................................... 32 4.5.4 Power-on/Power-off Flow ..................................................................................... 32 4.6 UART Interface ......................................
MW3650 0 Hardware Development Guide of Module Products 7.2.3 8 9 Related Test & Test Standard ...................................................................................................... 55 8.1 Testing Reference .......................................................................................................... 55 8.2 Description of Testing Environment .............................................................................. 56 8.3 Reliability Testing Environment ...............
MW3650 0 Hardware Development Guide of Module Products Figures Figure 2-1 Figure 4-1 Figure 4-2 Figure 4-3 Figure 4-4 Figure 4-5 Figure 4-6 Figure 4-7 Figure 4-8 Figure 4-9 Figure 4-10 Figure 4-11 Figure 4-12 Figure 5-1 Figure 5-2 Figure 9-1 Figure 9-2 Figure 9-3 Figure 9-4 System Connection Structure ............................................................................. 16 PIN Configuration Diagram ............................................................................... 23 Wakeup Waveform..
MW3650 0 Hardware Development Guide of Module Products Tables Table 1-1 Table 1-2 Table 2-1 Table 2-2 Table 2-3 Table 3-1 Table 4-1 Table 4-2 Table 4-3 Table 4-4 Table 4-5 Table 4-6 Table 4-7 Table 4-8 Table 4-9 Table 4-10 Table 4-11 Table 5-1 Table 5-2 Table 5-3 Table 6-1 Table 6-2 Table 6-3 Table 6-4 Table 7-1 Table 7-2 Table 7-3 Table 7-4 Table 7-5 Table 8-1 Table 8-2 Table 8-3 Table 8-4 Table 8-5 Table 8-6 Table 8-7 Table 9-1 Table 9-2 Support Documents List ...........................................
MW3650 0 Hardware Development Guide of Module Products R&TTE Regulation: In all cases assessment of the final product must be mass against the Essential requirements of the R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.2 requirements. Hereby, ZTE CORPORATION declares that this product is in complies with the essential requirements of Article 3 of the R&TTE 1999/5/EC Directive.
MW3650 0 Hardware Development Guide of Module Products 1 About This Document 1.1 Application Range This document is applicable as the hardware development guide of MW3650 module produce. Users need to design products according to the requirement and guide of this document. This document only can be applied to the hardware application development of MW3650 module product. 1.2 Purpose This document provides the hardware solutions and development fundamentals for a product with the module.
MW3650 0 Hardware Development Guide of Module Products 1.3 Supported & Reference Documents List Besides this hardware development guide, we also provide the Datasheet document, software development guide and AT command reference guide. Table 1-1 is the support document list. Table 1-1 Document NO. 1 Support Documents List Document Name ZTEWelink Software Development Guide of Module Product(MG3732_V2A&MW3650).pdf 2 ZTEWelink MW3650 Datasheet.
MW3650 0 Hardware Development Guide of Module Products Abbreviations Full Name EMI Electro Magnetic Interference ESD Electronic Static Discharge ETS European Telecommunication Standard FDMA Frequency Division Multiple Access FR Full Rate GPRS General Packet Radio Service GSM Global Standard for Mobile Communications IC Integrated Circuit IMEI International Mobile Equipment Identity ISO International Standards Organization ITU International Telecommunications Union LCD Liquid Crystal
MW3650 0 Hardware Development Guide of Module Products 2 Product Overview MW3650 is a WCDMA/HSDPA/GSM/GPRS/EDGE industry module developed by our company, and it is a wireless Internet module with LCC interface. The module has voice(optional), short message and data service functions. The downlink peak data rate is 3.6Mbps and the uplink peak data rate is 384Kbps, so it can supply the users with economical high speed internet access business, wireless data business and so on.
MW3650 0 Hardware Development Guide of Module Products 2.1 Technical Parameters The major features of the module can be described from the aspects of mechanic feature, base band, radio frequency, technical standard, environment features and so on. Table below is a list of the major technical parameters and features supported by module. Table 2-2 Type Mechanical Feature Item Specifications Dimensions (L × W × H) 30.0mm × 30..0mm × 2.
MW3650 0 Hardware Development Guide of Module Products Type Item Specifications WCDMA2100 : ≤-108dBm WCDMA1900 : ≤-109dBm Receiving sensitivity WCDMA900 : ≤-109dBm WCDMA850 : ≤-109 dBm GSM850/900/1800/1900 : ≤-107dBm Main Antenna External, Provide Antenna PAD GSM CS: UL 9.6kbps/DL 9.6kbps GPRS: Multi-slot Class 10 Data Rate EDGE: Multi-slot Class 12 WCDMA CS: UL 64kbps/DL 64kbps WCDMA PS: UL 384kbps/DL 384kbps Technical Standard HSDPA HSDPA: DL 3.
MW3650 0 Hardware Development Guide of Module Products NOTE: “NA” indicates nonsupport. Working current value is the average value tested under the max transmitter power. The value may be different in different condition and environment. Please take the actual measurement as the reference. Please make sure that the module is started up in the recommended working current range and working temperature to avoid the damage or the abnormal working of the module. 2.2 Function Overview 2.2.
MW3650 0 Hardware Development Guide of Module Products b) Support GSM/EDGE/GPRS 850/900/1800/1900MHz. c) The highest downlink rate supported by HSDPA is 3.6Mbit/s. d) PS domain supports EDGE CLASS12/GPRS CLASS10 bearer service. e) CS domain supports 64Kbit/s data service in WCDMA mode.
MW3650 0 Hardware Development Guide of Module Products 3 Mechanic Features 3.1 Module Illustration The Product Illustration of module is shown in the Figure 3-1. Table 3-1 Product Illustration NOTE: The picture above is just for reference; please take the actual products as the reference. Dimensions (L × W × H): 30.0 mm × 30.0mm ×2.3mm Weight: about 5g.
MW3650 0 Hardware Development Guide of Module Products 3.2 Module hex-vision images The module hex-vision images are shown in figure 3-2 (units: mm). Figure 3-2 module hex-vision images Note: the height in the figure above is without the module label, so it is 2.2mm. 3.3 Module Main Board PCB Encapsulation Dimension Diagram The detailed dimension of PCB welding panel is shown in figure 3-3 (units: mm).
MW3650 0 Hardware Development Guide of Module Products Figure 3-3 Figure 3-4 The detailed dimension of PCB welding panel Recommended Welding Panel Design Dimension of Customer Interface Board All Rights reserved, No Spreading abroad without Permission of ZTEWelink 20
MW3650 0 Hardware Development Guide of Module Products Figure 3-5 3.4 PCB Bottom Welding Panel PCB Design Guidelines To ensure the module has good performance in the application process, the users of modules should do as the following guidelines in the process of PCB wire designing: 1) For testing and maintenance convenience, the customer dev board PCB should be hollowed out to show the test pionts as is shown in the red box in figure 3-5 so as to do JTAG installation and debugging.
MW3650 0 Hardware Development Guide of Module Products 3.5 Suggestions for Heat-dissipation Design The module will dissipate heat during the working process, and might also be affected by other high-temperature devices. When do the heat-dissipation design, please pay attention to the following items: 1) Place this product far away from the switch power supply and high speed signal line, and protect the wiring of these interference sources.
MW3650 0 Hardware Development Guide of Module Products 4 Interfaces 4.1 Definition of PINs The definition of interface PINs on module is shown in figure 4-1.
MW3650 0 Hardware Development Guide of Module Products PIN Classification Signal Definition I/O Description Remark RESET PON_RESET_N I Reset signal 1.8V low level active 3 GND -- GND -- 4 VREF_2V8 O Voltage output 2.85V 5 VREF_1V8 O Voltage output 1.
MW3650 0 Hardware Development Guide of Module Products PIN Classification 38 Signal Definition I/O USIM_DATA I/O 39 USIM_RST O 40 VREG_USIM O 41 USIM_DETECT I 42 Reserved Description Remark USIM card data line 1.8V/3.0V USIM card reset signal 1.8V/3.0V USIM 1.8/3V power supply 1.8V/3.0V USIM card detect signal 1.
MW3650 0 Hardware Development Guide of Module Products PIN Classification Signal Definition I/O Description Remark 65 GPIO I/O GPIO -- 66 GPIO I/O GPIO -- 67 NC -- -- -- 68 NC -- -- -- 69 WWAN_STATE O Network status index signal 1. Power-on status: indicator light off; 2. network searching status: indicator light flickers with the frequency 70 SIG_LED O Module status of 3Hz; indicator light 3.Standyby status: indicator light flickers with the frequency of 1Hz; 4.
MW3650 0 Hardware Development Guide of Module Products 4.2 Hardware interface description The interfaces and peripheral circuit should be designed reasonably in the process of hardware development. The interface voltages of peripheral circuit must match with voltages of product pins., otherwise the performance may be influenced or the module cannot work normally or even be damaged.
MW3650 0 Hardware Development Guide of Module Products 4.3 Ground GND is the Ground signal of this product, and needs to be well connected to the ground on system board. If the GND signal is not connected completely, the performance of module will be affected. Well ground handing is important to module performance guarantee such as guaranteeing signal integrity, improving RF performance, reducing EMI interference and heat dissipation. In module ground handing process: 1.
MW3650 0 Hardware Development Guide of Module Products or LDO of that lager than 2A. In addition, considering that the transient current needed by high-power transmit is large under GSM model, so in the circuit design process, please add a large capability (lager than 470uF) in the output of DC/DC or LDO to avoid voltage decline abruptly. Sufficient line width of power line on system board should be guaranteed, and at the same time, the power line should form a well circumfluence with ground panel.
MW3650 0 Hardware Development Guide of Module Products As shown in the Figure below, use DC/DC switching power supply ZI1153 as the buck chip. Place a tantalum capacitor of 330UF at the input of the chip. Place a 2200UF capacitor or place several 330UF tantalum capacitors in parallel. This circuit fully meets the module power requirements.
MW3650 0 Hardware Development Guide of Module Products Considering the module power supply requirements, the PCB traces from the input connector to the power regulator IC must be wide enough to ensure no voltage drops occur when the 2A current peaks are absorbed. The recommended power wiring width is more than 100mil. The wiring of power supply should be far away from the circuit which is sensitive for noise such as microphone/earphone, RF cable and so on.
MW3650 0 Hardware Development Guide of Module Products 4.5.3 Reset You can reset the module by driving the PON_RESET_N to a low level voltage for more than 100ms and then releasing. After resetting, the module will shut down first and then enter power-on status automatically. Other advises To ensure that the data of module is well saved a, please do not cut off the module power during the module runtime. It is strongly recommended that use AT command (+ZPWROFF) to shut down the module in application.
MW3650 0 Hardware Development Guide of Module Products Figure 4-6 Power-on Sequence Chart of Module Figure 4-7 Power-off Sequence Chart of Module T1 V_MAIN T3 VBUS ON/OFF T2 T5 V_MAIN VBUS T4 ON/OFF Table 4-3 Parameter T1 T2 T3 T4 T5 Power-on/Power-off Time Description The time from power-on issue to VBUS ready From powering on V_MAIN to ON/OFF ready The time of active low level impulse of ON/OFF pin to power on module The time of active low level impulse of ON/OFF pin to power off modul
MW3650 0 Hardware Development Guide of Module Products 4.6 UART Interface The module provides a series of UART interfaces. The highest speed is 230.4Kbps and the typical speed is 115.2Kbps. The external interface PWL is 1.8V CMOS PWL signal used for UART communication. The definition and interface mode of UART are shown as followed. Table 4-4 PIN No.
MW3650 0 Hardware Development Guide of Module Products Figure 4-8 Figure 4-9 UART Interface PWL Conversion Reference Design Module Serial Port & AP Application Processor RXD TXD TXD RXD CTS RFR RFR CTS Module DTR DTR DSR DSR DCD DCD RI GND AP RI GND To catch LOG during the software debugging process, it is recommended for users to keep this interface and reserve testing points. If the module is connected with the application processor whose PWL is 1.
MW3650 0 Hardware Development Guide of Module Products Figure 4-10 The Connection of UART and Standard RS-232-C Interface The module support standard 8-wire UART interfaces and transfer digital signals, please isolate them from sensitive signals to avoid influencing other analog signal and RF signal. 4.7 (U)SIM Card Interface Module baseband processor integrates the (U)SIM card interface to compliance with ISO 7816-3 standards, and supports 3.0V/1.8V (U)SIM cards.
MW3650 0 Hardware Development Guide of Module Products than 0.5mm. The bypass circuit between VREG_USIM and SIM_GND should not be bigger than 1uF, and be placed near the SIM card console. 4) To avoid the potential interference between USIM_CLK and USIM_DATA signal, please do not place the wiring of them too near, and USIM_CLK and USIM_DATA signal need to be surrounded by Ground. USIM_RST signal also needs ground protection. Add a 0.1uF or 0.
MW3650 0 Hardware Development Guide of Module Products 4.8 USB Interface MW3650 module has the high-speed USB2.0 interface. It is connected to the system board side by LCC interface, which is the path for communication between the processor on the system board side and module of which the pins are PIN23(USB_DM) and PIN24(USB_DP). The definition of USB pins is shown in table 4-6. Table 4-6 PIN NO.
MW3650 0 Hardware Development Guide of Module Products Figure 4-12 USB Interface Circuit Reference Design Schematic Diagram Usually, USB interface of module can be enumerated to several ports, such as AT port, DIAG port, Modem port and so on. These ports are enumerated in order during the load process. For example, during the load process of module under Linux system, if the enumeration of DIAG port is ttyUSB0, the ports maps on PC are shown in the following table.
MW3650 0 Hardware Development Guide of Module Products The indicator light reference design is shown in the following figure. The luminance of LED can be regulated by the value of resistance. The indicator status of network is as defined in table below Table 4-8 Indicator Light Reference Design Schematic Diagram Table 4-9 The Description of Working Status Indicator Light Module status 4.
MW3650 0 Hardware Development Guide of Module Products Stop mode—Under the stop mode, SPI is not available, so the power consumption is reduced. If SPI is configured as the master equipment, any transmission process will be stopped, but it can enter the running mode when the waiting mode stops. 4.11 I2C Bus I2C is the two-wire bus for the communication between ICs, which supports any IC process (NMOS, CMOS, dual-polarity).
MW3650 0 Hardware Development Guide of Module Products 4.12 User Interface AT commands are mainly used for communication between users and the module. AT commands comply with ITU-T V.250, 3GPP 27.007 and 3GPP 27.005 standards. Moreover, the module also supports ZETWelink expanding AT commands.
MW3650 0 Hardware Development Guide of Module Products 5 Antenna 5.1 Preliminary Antenna Evaluation The antenna is a sensitive device and its performance is greatly affected by external environments. The radiation performance of the antenna is affected by the mainboard dimensions, antenna position, occupied space size of the antenna, and the grounding of surrounding components of the antenna.
MW3650 0 Hardware Development Guide of Module Products Figure 5-1 Translation Circuit Diagram Microstrip line or stripline with a natural impedance of 50 ohm Anten na Dual-L matching network RF interface on the antenna RF cable and RF interface on the mainboard Microstrip line or stripline with a natural impedance of 50 ohm RF interface on the module RF coaxial cable of the antenna PIN62 is antenna pin. The following items should be noticed when this pin is used an antenna feed pin.
MW3650 0 Hardware Development Guide of Module Products Because different antenna manufacturers may adopt different antenna modes and different terminal products have different external dimension and different requirements for antenna performance, the reserved spaces as well as antenna dimension and location are all different. Take the 3G internet laptops as an example, the recommended antenna space dimension is larger than 7mm*10mm*100mm, and it is recommended to place the antenna at the top of LCD screen.
MW3650 0 Hardware Development Guide of Module Products 4) RF cables of the antenna should be far from modules and components that might generate EMI, such as chip and memory, power interface, and data cable interface. The wiring of RF cables should be close to the ground of the mainboard. 5.6 Index Requirement of Antenna Module supported electronic communications pay more and more attention to collect radiation performance test.
MW3650 0 Hardware Development Guide of Module Products VSWR <3.5:1 <3.5:1 Maximum gain >-3dBi >-3dBi Average gain >-6.5dBi >-6.5dBi Efficiency >20% >20% NOTE: MW3650 module does not support diversity reception. 5.6.2 Active Index of Antenna Active index is an important index weighing the radiation performance of whole device (including antenna, module and circuit main board), so the active index decides the final radiation performance of product.
MW3650 0 Hardware Development Guide of Module Products 5.6.3 OTA Test method of Whole Machine Antenna Refer to the OTA test method of corresponding products in CTIA. Figure 5-6 is the structure of OTA test system in CTIA. This system mainly consists of darkroom, high-precision location system and its controller, RF test instrument and PC with automatic test program. The main RF instruments involve integrated testing instrument, frequency spectrograph and network analyzer.
MW3650 0 Hardware Development Guide of Module Products 6 Electric Feature This section mainly introduces the electric features of the module, including module interface PWL, power dissipation, reliability and so on. 6.1 Interface PWL See table 6-1 for the main outward interface PWL of the module. Table 6-1 Interface PWL Main Out ward Interface PWL of Module Min Typical Max 0 -- 0 0.1*V_UART 1 0.9*V_UART V_UART -- 0 -- 0 0.1*VREG_USIM 1 0.
MW3650 0 Hardware Development Guide of Module Products Table 6-3 Mode The Current Consumption under Sleep Mode Frequency Band Test value (mA) Band I (IMT2100) <5 Band II (PCS1900) <5 BandV(850) <5 BandVIII(900) <5 GSM1900 <5 GSM1800 <5 GSM900 <5 GSM850 <5 Remark WCDMA Sleep mode GSM Note:USB bus is fully suspended under this mode. In this mode, the module can also accept SM from the network. The power consumption is decreased to the lowest level.
MW3650 0 Hardware Development Guide of Module Products 7 Technical Index of Radio Frequency Test Environment: Test instrument: Agilent 8960 Power supply: Agilent 66319D RF cable length: About 15 cm WCDMA 850 MHz/900 MHz compensation: 0.6dB WCDMA 2100 MHz/1900 MHz compensation: 0.8dB NOTE: The compensation value is set by the frequency characteristic of corresponding RF cable. The compensation mode is related to the equipment. 7.
MW3650 0 Hardware Development Guide of Module Products UMTS2100 7.1.2 Class 3 +24dBm +1/-3dBm 22.45 Receiving Sensibility The receiving sensitivity is a key parameter that indicates the weakest signal strength the module can receive and work well with it. At the same time the BER (Bit Error Rate) must meet the 3GPP TS 34.121protocol requirements in case of the minimum signal. The test value of UMTS2100/900 receiving sensibility is shown in the Table 7-2. Table 7-2 Operating Band 7.1.
MW3650 0 Hardware Development Guide of Module Products 7.2.1 Maximum Transmission Power Maximum transmission power is another very important index to weigh the module performance. It is the maximum transmission power the module can transmit tested at the antenna port. Under the normal testing environment, the test value and reference value of the maximum transmission power of GSM850/900/1800/1900 (GMSK/8PSK) are shown in the table 7-4.
MW3650 0 Hardware Development Guide of Module Products The test power should be less than -30dBm tested under the frequency between 1GHz and 12.75GHz.
MW3650 0 Hardware Development Guide of Module Products 8 Related Test & Test Standard 8.1 Testing Reference The related tests of MODULE comply with the IEC standard, including the equipment running under high/low temperature, storage under high/low temperature, temperature shock and EMC. Table 8-1 is the list of testing standard, which includes the related testing standards for MODULE. Table 8-1 Test Standard Testing Standard Document Reference IEC6006826 Environmental testing-Part2.
MW3650 0 Hardware Development Guide of Module Products 8.2 Description of Testing Environment The working temperature range of MODULE is divided into the normal working temperature range and the extreme working temperature range. Under the normal working temperature range, the testing result of RF complies with the requirements of 3GPP specifications, and its function is normal.
MW3650 0 Hardware Development Guide of Module Products Temperature shock Low temperature: -40°C ±2°C IEC 68-2-14 Na High temperature: +90°C ±2°C Temperature changing period: less than 30s Test duration: 2 hours Cycle: 10 High-temperature running Normal high temperature: 75 °C ZTE standard Extreme high temperature: 80°C Duration: 4 hours Low-temperature running Normal low temperature: -30°C ZTE standard Extreme low temperature: -40°C Duration: 4 hours High temperature & high Temperature: +60°C hum
MW3650 0 Hardware Development Guide of Module Products 8.5 ESD Characteristic Module is sensitive to ESD in the process of storage, transporting and assembling. Especially, the module is mounted on the users’ mother board, The ESD components should be placed beside the connectors which human body might touch, such as USIM card holder, audio jacks, switches and keys, etc. The measured ESD values of module at the normal temperature are shown as the following table.
MW3650 0 Hardware Development Guide of Module Products 9 SMT Process and Baking Guide Now there are more and more products in our company. Customers may meet a lot of welding problems. So, we provide this SMT process and baking guide particularly for customers to ensure the first pass yield of the module on customer side. 9.1 Storage Requirements Storage conditions: temperature<40℃, relative humidity<90% (RH), 12 months weldability guaranteed under this circumstances of excellent sealing package.
MW3650 0 Hardware Development Guide of Module Products Figure 9-1 Green oil and white oil at module’s position on main board The white oil need be removed (The figure is just for reference; it doesn’t represent the actual module encapsulation) In addition, do not lay out other components within 2mm around the module’s position on main board to ensure the maintenance of the module. 9.3 Module Planeness Standard The module’s planeness is required to be 0.15mm.
MW3650 0 Hardware Development Guide of Module Products 9.3.3 Design of module PAD’s steel mesh opening on main board The thickness of the steel mesh on main board is selected according to the encapsulation type of components on the main board. Pay attention to the following requirements: 1) Make sure to design the module PAD on main board according to the third item as below. 2) The thickness of steel mesh is 0.15mm or 0.18mm, but the thickness at the position of module pad can be increased to 0.18~0.
MW3650 0 Hardware Development Guide of Module Products Figure 9-2 0.1mm Module Board’s Steel Mesh Diagram 0.1mm 0.5mm Steel mesh opening Module PAD on PCB 0.1mm 9.3.4 1) Module Board’s SMT process SMT Pallets: The pallets, which are suitable for SMT, have been made for most ZTE modules. If the module has provided the pallets itself and meets the SMT requirements, customers can directly use it for module SMT.
MW3650 0 Hardware Development Guide of Module Products In order to ensure a good contact between the module and the solder paste on main board, the pressure of placing the module board on main board should be 2-5N according to our experiences. Different modules have different numbers of pads, therefore the pressure selected are different.
MW3650 0 Hardware Development Guide of Module Products Note: The test board of furnace temperature must be the main board with the module board mounted on, and there must be testing points at the position of module board. 9.3.6 Reflow method If the main board used by customers is a double-sided board, it is recommended to mount the module board at the second time. In addition, it is preferable for the main board to reflow on the mesh belt when mounting at the first time and the second time.
MW3650 0 Hardware Development Guide of Module Products 9.4.2 Baking device and operation procedure Baking device: any oven where the temperature can rise up to 125°C or above. Precautions regarding baking: during the baking process, the modules should be put in the high-temperature resistant pallet flatly and slightly to avoid the collisions and frictions between the modules. During the baking process, do not overlay the modules directly because it might cause damage to the module’s chipset. 9.4.
MW3650 0 Hardware Development Guide of Module Products 10 Safety Warnings and Notes During the process of the module secondary development, use and repair, all the safety warnings and notes in this section should be followed. The module integrator must pass the following safety information to users and operators or integrate the information into product operating manual: When RF devices including the module are used, the electronic devices whose shielding performance is not good may be interfered.
MW3650 0 Hardware Development Guide of Module Products Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
MW3650 0 Hardware Development Guide of Module Products As long as 2 conditions above are met, further transmitter test will not be required.
